PDF《of Ground Bounce Noise》

2006 IEEE

268 IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, VOL. 16, NO. 5, MAY

2006 Fig. 2. Comparison of jS j between the PPW, - and L-bridged PBG power plane. Fig. 3. Measured GBN suppression behavior for noise excitation located at two different locations, Port

2 (74 mm,

74 mm) and Port

3 (74 mm,

45 mm), respectively. shows the proposed -bridged PBG power planes with nine cells. And the unit cell of the -bridged PBG and its corre- sponding parameter notations is shown in Fig. 1(b), where 0.2 mm, 0.2 mm, 0.3 mm,

19 mm,

2 mm, 7.5 mm, 28.35 mm. Compared with the -bridged PBG structures proposed by Wu et al. in [10], the inductance between the two neighboring pads of the -bridged PBG structures is ?ve times as large as that of the L-bridged structures when the width of lines is the same. It makes the proposed P/G structures could suppress the GBN at low frequency effectively. And the inserts etched on the power plane change the ?ow paths of currents. This discon- tinuity makes the proposed structures could suppress the GBN at high frequencies. III. RESULTS Fig.

2 shows the measured and simulated for the de- signed -bridged PBG P/G planes and the simulated of solid parallel plate waveguide (PPW) and -bridged P/G planes in [10], where the thickness of the FR4 substrate is 0.4 mm the same as that in [10], and Port

1 and Port

2 are located at (46 mm,

45 mm) and (74 mm,

74 mm), respectively. The HFSS of An- soft Corporation is used to simulate the structures. And excellent agreement is obtained from dc to

6 GHz between the measure- ments and simulations. From this ?gure, we can ?nd that the GBN is suppressed from

300 MHz to

6 GHz with a 5.7-GHz bandwidth, almost the whole noise band de?ned in [6] and [7]. And the bandwidth is de?ned by lower than

30 dB. Fig.

3 shows the measured GBN suppression behavior for noise excitation port located at two different locations, Port

2 (74 mm,

74 mm) and Port

3 (74 mm,

45 mm), respectively. The receiving port is all at Port 1. We can ?nd that the GBN is still suppressed in a wide noise band. So the proposed -bridged PBG structures can omnidirectionally eliminate the GBN be- tween the P/G planes. IV. CONCLUSION In this letter, a novel -bridged PBG power plane with low- period uniplanar compact structures is proposed to eliminate the GBN from

300 MHz to

6 GHz almost the whole noise band. Compared with the traditional and Wu'

s structures, our power planes have two key features, the -bridges and the inserts, which suppress the GBN at low and high frequencies, respec- tively. The excellent performance of the low-period PBG power planes is veri?ed by measurement and simulation. So the pro- posed structure can be widely used in high-speed integrated circuits. REFERENCES [1] S. Van den Berghe, F. Olyslager, D. De Zutter, J. De Moerloose, and W. Temmerman, Study of the ground bounce caused by power plane resonances, IEEE Trans. Electromagn. Compat., vol. 40, no. 2, pp. 111C119, May 1998. [2] G.-T. Lei, R. W. Techentin, and B. K. Gilbert, High frequency char- acterization of power/ground-plane structures, IEEE Trans. Microw. Theory Tech., vol. 47, no. 5, pp. 562C569, May 1999. [3] T. L. Wu, S. T. Chen, J. N. Huang, and Y. H. Lin, Numerical and experimental investigation of radiation caused by the switching noise on the partitioned dc reference planes of high speed digital PCB, IEEE Trans. Electromagn. Compat., vol. 46, no. 1, pp. 33C45, Feb. 2004. [4] R. Abhari and G. V. Eleftheriades, Suppression of the parallel-plate noise in high-speed circuits using a metallic electromagnetic band-gap structure, in IEEE MTT-S Int. Dig., Jun. 2002, pp. 493C496. [5] ――, Metallo-dielectric electromagnetic bandgap structures for sup- pression and isolation of the parallel-plate noise in high-speed circuits, IEEE Trans. Microw. Theory Tech., vol. 51, no. 6, pp. 1629C1639, Jun. 2003. [6] T. Kamgaing and O. M. Ramahi, A novel power plane with inte- grated simultaneous switching noise mitigation capability using high impedance surface, IEEE Microw. Wireless Comp. Lett., vol. 13, no. 1, pp. 21C23, Jan. 2003. [7] S. Shahparnia and O. M. Ramahi, Simultaneous switching noise mit- igation in PCB using cascaded high-impedance surfaces, Electron. Lett., vol. 40, no. 2, pp. 98C100, Jan. 2004. [8] ――, Electromagnetic Interference (EMI) reduction from Printed Cir- cuit Boards (PCB) using electromagnetic bandgap structures, IEEE Trans. Electromagn. Compat., vol. 46, no. 4, pp. 580C586, Nov. 2004. [9] T.-L. Wu, Y.-H. Lin, and S.-T. Chen, A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures, IEEE Microw. Wireless Compon. Lett., vol. 14, no. 7, pp. 337C339, Jul. 2004. [10] T.-L. Wu, C.-C. Wang, Y.-H. Lin, T.-K. Wang, and G. Chang, A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits, IEEE Microw. Wireless Com........