PDF《ZHCSJ84 – DECEMBER 2018》

3 LM95071-Q1 www.ti.com.cn ZHCSJ84 CDECEMBER

2018 Copyright ? 2018, Texas Instruments Incorporated

5 Pin Configuration and Functions DBV Package 5-Pin SOT-23 Top View Pin Function PIN DESCRIPTION NO. NAME

1 CS Chip Select input. This pin receives an active-low signal from the controller to select the device.

2 GND Ground. This is the power and signal ground return.

3 SI/O Serial Input/Output. This serial, bidirectional, data bus pin transmits and receives signals to and from the controller. Schmitt trigger input in the input mode.

4 SC Serial bus clock. This serial clock signal comes from the controller. Schmitt trigger input.

5 VDD Positive Supply Voltage. Supply a DC voltage from 2.4V to 5.5V to this pin and bypass with a 0.1-?F ceramic capacitor to ground. (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its rated operating conditions. (2) Soldering process must comply with Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging. (3) Reflow temperature profiles are different for lead-free and non-lead-free packages. (4) When the input voltage (VI) at any pin exceeds the power supplies (VI <

GND or VI >

VDD) the current at that pin should be limited to

5 mA.

6 Specifications 6.1 Absolute Maximum Ratings (1)(2)(3) MIN MAX UNIT Supply voltage ?0.3

6 V Voltage at any pin ?0.3 VDD + 0.3 V Input current at any pin (4)

5 mA Storage temperature, Tstg ?65

150 °C (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) HBM ESD Classification Level

2 ±2000 V Charged-device model (CDM), per AEC Q100-011 CDM ESD Classification Level C2 ±200

4 LM95071-Q1 ZHCSJ84 CDECEMBER

2018 www.ti.com.cn Copyright ? 2018, Texas Instruments Incorporated (1) The life expectancy of the of the LM95071-Q1 will be reduced when operating at elevated temperatures. of the LM95071-Q1 θJA (thermal resistance, junction-to-ambient) when attached to a printed-circuit board with 2-oz. foil is summarized in the table below. 6.3 Recommended Operating Ratings MIN MAX UNIT Specified temperature(1) , TMIN to TMAX ?40

150 °C Supply voltage (VDD) 2.4 5.5 V (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) LM95071-Q1 UNIT DBV (SOT-23)

5 PINS RθJA Junction-to-ambient thermal resistance 167.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 118.8 °C/W RθJB Junction-to-board thermal resistance 30.7 °C/W ψJT Junction-to-top characterization parameter 14.4 °C/W ψJB Junction-to-board characterization parameter 30.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W (1) Limits are guaranteed to TI'

s AOQL (Average Outgoing Quality Level). (2) Typicals are at TA = 25°C and represent most likely parametric norm. (3) The of the LM95071-Q1 will operate properly over the VDD supply voltage range of 2.4V to 5.5V. (4) Following a power on reset, the user must allow at least

228 ms before making the first read transaction to ensure a first valid temperature read. After the first read, in order to ensure an accurate temperature result, the time interval between any two consecutive temperature reads must be greater than the maximum conversion time of