PPT《电路板（PCB）字汇整理》

电路板(PCB)字汇整理 教育训练教材仅供内部使用严禁翻印(2000.

06.07) PCB字典 流程图PCB Mfg. FLOW CHART UPDATED:1999,09,01 多层板内层流程 (INNER LAYER PRODUCT) 多次埋孔Multiple Buried Via 徐振连JOHNNY HSU 顾客(CUSTOMER) 工程制前(FRONT-END DEP.) 裁板(LAMINATE SHEAR) 内层乾膜(INNERLAYER IMAGE) 预叠板及叠板(LAY- UP ) 通孔电镀(P . T . H .) 液态防焊(LIQUID S/M ) 外观检查(VISUAL INSPECTION ) 成型(FINAL SHAPING) 业务(SALES DEPARTMENT) 生产管理(P&

M CONTROL) 蚀铜(I/L ETCHING) 钻孔(PTH DRILLING) 压合(LAMINATION) 外层乾膜(OUTERLAYERIMAGE) 二次铜及锡铅电镀 (PATTERN PLATING) 蚀铜(O/L ETCHING) 检查(INSPECTION 喷锡(HOT AIR LEVELING) 电测(ELECTRICAL TEST) 出货前检查(O. Q. C. ) 包装出货(PACKING&

SHIPPING) 曝光(EXPOSURE) 压膜(LAMINATION) 前处理 (PRELIMINARY TREATMENT ) 显影(DEVELOPIG) 蚀铜(ETCHING) 去膜(STRIPPING) 黑化处理(BLACK OXIDE) 烘烤(BAKING) 预叠板及叠板(LAY- UP ) 压合(LAMINATION) 后处理(POSTTREATMENT) 曝光(EXPOSURE) 压膜(LAMINATION) 二次铜电镀(PATTERNPLATING) 锡铅电镀(T/L PLATING) 去膜(STRIPPING) 蚀铜(ETCHING) 剥锡铅(T/L STRIPPING) 涂布印刷(S/M COATING) 预乾燥(PRE-CURE) 曝光(EXPOSURE) 显影(DEVELOPING) 后烘烤(POST CURE) MLB 全板电镀(PANEL PLATING) 铜面防氧化处理O.S.P (Entek Cu 106A) 外层制作(OUTER-LAYER) TENTING PROCESS 镀金手指 (G/F PLATING) 镀化学镍金(E-less Ni/Au) For O. S. P. 选择性镀镍镀金(SELECTIVE GOLD) 印文字(SCREEN LEGEND) 网版制作(STENCIL) 图面(DRAWING) 工作底片(WORKING A/W ) 制作规(RUN CARD) 程式带(PROGRAM ) 钻孔,成型机(D. N. C.) 底片(MASTER A/W) 磁片, 磁带(DISK , M/T) 蓝图(DRAWING) 资料传送(MODEM , FTP) A O I 检查(AOI INSPECTION ) 除胶渣(DESMER) 通孔电镀(E-LESS CU) DOUBLE SIDE 前处理 (PRELIMINARY TREATMENT ) 前处理 (PRELIMINARY TREATMENT ) 前处理 (PRELIMINARY TREATMENT ) 全面镀镍金 (S/G PLATING) 雷射钻孔(LASER ABLATION) Blinded Via 埋孔钻孔(I.V.H. DRILLING) 埋孔电镀(I.V.H. PLATING) 埋孔(Buried via) P1/136 * Process Module 说明 :A. 下料 ( Cut Lamination) a-1 裁板 ( Sheets Cutting) a-2 原物料发料 (Panel)(Shear material to Size)B. 钻孔 (Drilling) b-1 内钻 (Inner Layer Drilling ) b-2 一次孔(Outer Layer Drilling ) b-3 二次孔 (2nd Drilling) b-4 雷射钻孔 (Laser Drilling )(Laser Ablation ) b-5 盲(埋)孔钻孔 (Blind &

Buried Hole Drilling)C. 乾膜制程 ( Photo Process(D/F)) c-1 前处理 (Pretreatment) c-2 压膜(Dry Film Lamination) c-3 曝光(Exposure) c-4 显影(Developing) c-5 蚀铜 (Etching) c-6 去膜 (Stripping) c-7 初检 ( Touch-up) c-8 化学前处理,化学研磨 ( Chemical Milling ) c-9 选择性浸金压膜 (Selective Gold Dry Film Lamination) c-10 显影(Developing ) c-11 去膜(Stripping )D. 压合Lamination d-1 黑化(Black Oxide Treatment) d-2 微蚀(Microetching) Developing , Etching &

Stripping ( DES ) d-3 铆钉组合 (eyelet ) d-4 叠板 (Lay up) d-5 压合(Lamination) d-6 后处理 (Post Treatment) d-7 黑氧化 ( Black Oxide Removal ) d-8 铣靶 (spot face) d-9 去溢胶 (resin flush removal)E. 减铜 (Copper Reduction) e-1 薄化铜(Copper Reduction)F. 电镀 (Horizontal Electrolytic Plating) f-1 水平电镀 (Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀 ( Tin-Lead Plating ) (Pattern Plating) f-3 低於

1 mil ( Less than

1 mil Thickness ) f-4 高於

1 mil ( More than

1 mil Thickness) f-5 砂带研磨 (Belt Sanding) f-6 剥锡铅 ( Tin-Lead Stripping) f-7 微切片 ( Microsection)G. 塞孔 (Plug Hole) g-1 印刷 ( Ink Print ) g-2 预烤 (Precure) g-3 表面刷磨 (Scrub) g-4 后烘烤 (Postcure)H. 防焊(绿漆): (Solder Mask) h-1 C面印刷 (Printing Top Side) h-2 S面印刷 (Printing Bottom Side) h-3 静电喷涂 (Spray Coating) h-4 前处理 (Pretreatment) h-5 预烤 (Precure) h-6 曝光 (Exposure) h-7 显影 (Develop) h-8 后烘烤 (Postcure) h-9 UV烘烤 (UV Cure) h-10 文字印刷 ( Printing of Legend ) h-11 喷砂 ( Pumice)(Wet Blasting) h-12 印可剥离防焊 (Peelable Solder Mask)I . 镀金 Gold plating i-1 金手指镀镍金 ( Gold Finger ) i-2 电镀软金 (Soft Ni/Au Plating) i-3 浸镍金 ( Immersion Ni/Au) (Electroless Ni/Au)J. 喷锡 (Hot Air Solder Leveling) j-1 水平喷锡 (Horizontal Hot Air Solder Leveling) j-2 垂直喷锡 ( Vertical Hot Air Solder Leveling) j-3 超级焊锡 (Super Solder ) j-4. 印焊锡突点 (Solder Bump)K. 成型 (Profile)(Form) k-1 捞型 (N/C Routing ) (Milling) k-2 模具冲 (Punch) k-3 板面清洗烘烤 (Cleaning &

Backing) k-4 V型槽 ( V-Cut)(V-Scoring) k-5 金手指斜边 ( Beveling of G/F)L. 短断路测试 (Electrical Testing) (Continuity &

Insulation Testing) l-1 AOI 光学检查 ( AOI Inspection) l-2 VRS 目检 (Verified &

Repaired) l-3 泛用型治具测试 (Universal Tester) l-4 专用治具测试 (Dedicated Tester) l-5 飞针测试 (Flying Probe)M. 终检 ( Final Visual Inspection) m-1 压板翘 ( Warpage Remove) m-2 X-OUT 印刷 (X-Out Marking) m-3 包装 及出货 (Packing &

shipping) m-4 目检 ( Visual Inspection) m-5 清洗 及烘烤( Final Clean &

Baking) m-6 护铜剂 (ENTEK Cu-106A)(OSP) m-7 离子残余量测试 (Ionic Contamination Test )(Cleanliness Test) m-8 冷热冲击试验 (Thermal cycling Testing) m-9 焊锡性试验 ( Solderability Testing )N. 雷射钻孔(Laser Ablation) N-1 雷射钻Tooling孔(Laser ablation Tooling Hole) N-2 雷射曝光对位孔(Laser Ablation Registration Hole) N-3 雷射Mask制作(Laser Mask) N-4 雷射钻孔(Laser Ablation) N-5 AOI 检查及VRS ( AOI Inspection &

Verified &

Repaired) N-6 Blaser AOI (after Desmear and Microetching) N-7 除胶渣 (Desmear) N-8 微蚀 (Microetching ) A/W (artwork)底片Ablation 烧溶(laser),切除abrade 粗化abrasion resistance 耐磨性absorption 吸收ACC ( accept 允收accelerated corrosion test 加速腐蚀accelerated test 加速试验acceleration 速化反应accelerator 加速剂acceptable 允收activator 活化液active work in process 实际在制品adhesion 附著力adhesive method 黏著法air inclusion 气泡air knife 风刀amorphous change 不定形的改变amount 总量amylnitrite 硝基戊烷analyzer 分析仪anneal 回火annular ring 环状垫圈;

孔环anode slime (sludge)阳极泥anodizing 阳极处理AOI ( automatic optical inspection )自动光学检测applicable documents 引用之文件AQL sampling 允收水准抽样aqueous photoresist 液态光阻aspect ratio 纵横比(厚宽比)As received 到货时 back lighting 背光back-up 垫板 banked work in process 预留在制品base material 基材baseline performance 基准绩效batch 批beta backscattering 贝他射线照射法beveling 切斜边;

斜边biaxial deformation 二方向之变形black-oxide 黑化blank controller 空白对照组 blank panel 空板blanking 挖空blip 弹开blister 气泡;

起泡blistering 气泡blow hole 吹孔board-thickness error 板厚错误bonding plies 黏结层bow ;

bowing 板弯break out 从平环内破出bridging 搭桥;

桥接BTO (Build To Order)接单生产burning 烧焦burr 毛边(毛头)camcorder 一体型摄录放机carbide 碳化物carlson pin 定位梢carrier 载运剂catalyzing 催化catholic sputtering 阴极溅射法caul plate 隔板;

钢板calibration system requirements 校验系统之各种要求center beam method 中心光束法central projection 集中式投射线certification 认证chamfer 倒角 (金手指)chamfering 切斜边;

倒角characteristic impedance 特性阻抗charge transfer overpotential 电量传递过电压chase 网框checkboard 棋盘chelator 蟹和剂chemical bond 化学键chemical vapor deposition 化学蒸著镀circumferential void 圆周性之孔破clad metal 包夹金属clean room 无尘室clearance 间隙coat 镀外表coating error 防焊覆盖错误 coefficient of thermal expansion (CTE) 热澎胀系数cold solder joint 冷焊点cold-weld 金属粉末冷焊color 颜色color error 颜色错误compensation 补偿competitive performance 竞争力绩效complex salt 错化物complexor 错化物component hole 零件孔component side 零件面concentric 同心conformance 密贴性consumer products 消费性产品contact resistance 接触电阻continuous performance 连续发挥效能contract service 协力厂controlled split 均裂式conventional flow 乱流方式conventional tensile test 传统张力测试法conversion coating 转化层convex 突出coordinate list 资料清单copper claded laminates (CCL)铜箔基板copper exposure 线路露铜copper mirror 镜铜copper pad 铜箔圆配copper residue (copper splash)铜渣corrosion rate numbering 腐蚀速率计数系统corrosion resistance 抗蚀性coulombs law 库伦定律countersink 喇叭孔coupon 试样coupon location 试样点covering power 遮盖力CPU 中央处理器crack 破裂;

裂痕crazing 裂痕;

白斑cross linking 交联聚合 cross talk 呼应作用crosslinking 交联crystal collection 结晶收集curing 聚合体current efficiency 电流效率cut-outs 挖空cutting 裁板cyanide 氰化物cycles of learning 学习循环cycle-time reduction 交期缩短date code 周期deburring 去毛头dedicated 专用型degradation 退变delamination 分层dent / pin hole 凹陷 / 针孔department of defense 国防部designation 字码简示法de-smear 除胶渣developing 显影dewetting 缩锡dewetting time 缩锡时间dimension error 外形尺寸错误dielectric constant 介质常数difficulty 困难度difunctional 双功能dimension 尺寸dimension stability 尺寸安定性dimensional stability 尺度安定性dimension and tolerance 尺寸与公差dirty hole 孔内异物discolor hole 孔黑;

孔灰;

氧化discoloration 变色disposable eyelet method 消耗性铆钉法distortion factor 尺寸变形函数double side 双面板 downtime 停机时间drill 钻孔drill bit 钻头drill facet 钻尖切p面drill pointer 钻尖重(研)磨机drilled blank board 已钻孔之裸板drilling 钻孔dry film 乾膜ductility 延展性economy of scale 经济规模edge spacing 板边空地edge-board contact ( gold finger ) 金手指efficiency 能量效率electric test 电测electrical testing 电测;

测试electrochemical machine ECM 电化学加工法electrochemical reactor 电化学反应器electroforming 电铸electroless plate 化学铜electroless-deposition 无电镀electropolishing 电解抛光electrorefining 电解精链electrowinning 电解萃取elliptical set 椭圆形embrittlement 脆性entitlement performance 可达成绩效entrapment 电镀夹杂物epoxy 环氧树酯equipotential 电位线error data file 异常情形etch rate 蚀铜速率etchants 蚀刻液etchback 回蚀evaluation program 评估用程式exposure 曝光external pin method 外部插梢法eyelet hole 铆钉孔Eyeletting 铆眼fabric 网布failure 故障 fast response 快速回应fault 瑕;

缺陷fiber exposure 纤维显露fiber protrusion 纤维突出fiducial mark 光学点,基准记号filler 填充料film 底片filtration 过滤finished board 成品fixing 固著fixture 电测夹具(治具)flaking off 粹离flammability rating 燃性等级flare 喇叭形孔flat cable 并排电缆feedback loop 回馈循环first-in-first-out (FIFO)先进先出flexible manufacturing system (FMS) 弹性制造系统flux 助焊剂foil distortion 铜层变形fold 空泡foreign include 异物foreign material 基材内异物free radical chain polymerization 自由基连锁聚合fully additive 加成........