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6 60 V External voltage at VCC 7.5
14 V Junction temperature C40
125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) LM5022 UNIT DGS (VSSOP)
10 PINS RθJA Junction-to-ambient thermal resistance 161.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance
56 °C/W RθJB Junction-to-board thermal resistance 81.3 °C/W ψJT Junction-to-top characterization parameter 5.7 °C/W ψJB Junction-to-board characterization parameter
80 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance ― °C/W
5 LM5022 www.ti.com.cn ZHCSHC6I CJANUARY 2007CREVISED DECEMBER
2017 Copyright ? 2007C2017, Texas Instruments Incorporated (1) All Minimum and Maximum limits are specified by correlating the electrical characteristics to process and temperature variations and applying statistical process control. The junction temperature (TJ in °C) is calculated from the ambient temperature (TA in °C) and power dissipation (PD in Watts) as follows: TJ = TA + (PD * RθJA) where RθJA (in °C/W) is the package thermal impedance provided in Thermal Information. (2) VCC provides bias for the internal gate drive and control circuits. (3) Device thermal limitations may limit usable range. 6.5 Electrical Characteristics Typical limits apply for TJ=25°C and are provided for reference purposes only;
minimum and maximum limits apply over the junction temperature (TJ) range of C40°C to 125°C. VIN =
24 V and RT = 27.4 kΩ (unless otherwise noted).(1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SYSTEM PARAMETERS VFB FB pin voltage 1.225 1.25 1.275 V STARTUP REGULATOR VCC VCC regulation(2)
10 V ≤ VIN ≤
60 V, ICC =
1 mA 6.6
7 7.4 V
6 V ≤ VIN <
10V, VCC Pin Open Circuit
5 ICC Supply current OUT Pin Capacitance = 0, VCC =
10 V 3.5
4 mA ICC-LIM VCC current limit VCC =
0 V(2)(3)
15 35 mA VIN - VCC Dropout voltage across bypass switch ICC =
0 mA, ?SW <
200 kHz,
6 V ≤ VIN ≤ 8.5 V
200 mV VBYP-HI Bypass switch turnoff threshold VIN increasing 8.7 V VBYP-HYS Bypass switch threshold hysteresis VIN Decreasing
260 mV ZVCC VCC pin output impedance
0 mA ≤ ICC ≤
5 mA VIN =
6 V
58 Ω VIN =
8 V
53 VIN =
24 V 1.6 VCC-HI VCC pin UVLO rising threshold
5 V VCC-HYS VCC pin UVLO falling hysteresis
300 mV IVIN Startup regulator leakage VIN =
60 V
150 500 ?A IIN-SD Shutdown current VUVLO =
0 V, VCC = Open Circuit
350 450 ?A ERROR AMPLIFIER GBW Gain bandwidth
4 MHz ADC DC gain
75 dB ICOMP COMP pin current sink capability VFB = 1.5 V, VCOMP =
1 V
5 17 mA UVLO VSD Shutdown threshold 1.22 1.25 1.28 V ISD-HYS Shutdown hysteresis current source
16 20
24 ?A CURRENT LIMIT tLIM-DLY Delay from ILIM to output CS steps from
0 V to 0.6 V, OUT transitions to 90% of VCC
30 ns VCS Current limit threshold voltage 0.45 0.5 0.55 V tBLK Leading edge blanking time
65 ns RCS CS pin sink impedance Blanking active
40 75 Ω SOFT START ISS Soft-start current source
7 10
13 ?A VSS-OFF Soft start to COMP offset 0.35 0.55 0.75 V
6 LM5022 ZHCSHC6I CJANUARY 2007CREVISED DECEMBER
2017 www.ti.com.cn Copyright ? 2007C2017, Texas Instruments Incorporated Electrical Characteristics (continued) Typical limits apply for TJ=25°C and are provided for reference purposes only;
minimum and maximum limits apply over the junction temperature (TJ) range of C40°C to 125°C. VIN =
24 V and RT = 27.4 kΩ (unless otherwise noted).(1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT (4) Specification applies to the oscillator frequency. OSCILLATOR fSW RT to GND = 84.5 kΩ 170(4)