PDF《MQ 10K00 L》

3 mm max. ? Solder Reflow in Furnace Recommended ? Peak temperature: 250+0/-5°C ? Holding time:

10 sec. max. ? To cool gradually at room temperature ? Dipping in Solder (Wave or Still) Recommended ? Temp. of solder: 260°C max ? Length of dipping:

10 seconds ? To cool gradually at room temperature ? Other Corrosion-free flux, such as rosin, is recommended. Do not apply pressure to the molded housing immediately after soldering. 3. Cleaning Use volatile cleaner such as methylalcohol or propyl alcohol. 4. Circuit Board Design The dimensions of solder land must be determined in conformity with the size of resistors and with the soldering method. They are also subject to the mounting machine and the material of the substrate. See example below. When parts are mounted on a board in high density, solder can possibly attach to the resistors in an excessive amount to affect performance or reliability of the resistors. To prevent this effect, the use of solder resist is recommended to isolate solder lands.

40 50

20 Not Applicable Applicable

10 30 Temp. of Iron

350 310

270 230

60 (sec.) Length of contact (°C) D Solder resist Solder land Adhesive (in wave soldering) A C Terminal B Resistor Circuit Board Type MP MQ A 1.6 to 2.0 B 0.5 to 1.5 C 2.2 to 2.6 D 1.8 2.5 Dimensions in mm