PDF《V40PWM15C》

125 °C

3 - VR =

150 V TA =

25 °C - 0.5 TA =

125 °C

6 20 Typical junction capacitance 4.0 V,

1 MHz CJ

870 - pF THERMAL CHARACTERISTICS (TA =

25 °C unless otherwise noted) PARAMETER SYMBOL V40PWM15C UNIT Typical thermal resistance R?JA (1)(2)

55 °C/W R?JM (3) 1.5 ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE V40PWM15C-M3/I 0.20 I

4500 13" diameter plastic tape and reel V40PWM15CHM3/I (1) 0.20 I

4500 13" diameter plastic tape and reel V40PWM15C www.vishay.com Vishay General Semiconductor Revision: 11-Feb-2019

3 Document Number:

87506 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RATINGS AND CHARACTERISTICS CURVES (TA =

25 °C unless otherwise noted) Fig.

1 - Maximum Forward Current Derating Curve Fig.

2 - Forward Power Loss Characteristics Fig.

3 - Typical Instantaneous Forward Characteristics Fig.

4 - Typical Reverse Leakage Characteristics Fig.

5 - Typical Junction Capacitance Fig.

6 - Typical Transient Thermal Impedance

0 10.0 20.0 30.0 40.0 50.0

0 25

50 75

100 125

150 175 Average Forward Rectified Current (A) Mount Temperature (°C) TM =

128 °C, RthJM = 1.5 °C/W TA =

25 °C, RthJA =

55 °C/W 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0

0 5

10 15

20 25 Average Power Lo ss (W) Average Forward Current (A) D = 0.1 D = 0.2 D = 0.3 D = 0.5 D = 1.0 D = 0.8 D = tp/T T tp 0.1

1 10

100 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 In s tantaneou s Forward Current (A) Instantaneous Forward Voltage (V) TJ =

150 °C TJ =

25 °C TJ =

100 °C TJ =

125 °C TJ =

175 °C 0.001 0.01 0.1

1 10

100 1000

10 20

30 40

50 60

70 80

90 100 In s tantaneou s Rever s e Current (mA) Percent of Rated Peak Reverse Voltage (%) TJ =

150 °C TJ =

125 °C T =

100 °C TJ =

25 °C TJ =

175 °C J

1 10

100 1000

10 000 0.1

1 10

100 1000 Junction Capacitance (pF) Reverse Voltage (V) TJ =

25 °C f = 1.0 MHz Vsig =

50 mVp-p 0.1

1 10

100 0.01 0.1

1 10

100 Tran s ient Thermal Impedance ( ° C/W) t - Pulse Duration (s) Junction to Ambient Junction to Mount V40PWM15C www.vishay.com Vishay General Semiconductor Revision: 11-Feb-2019

4 Document Number:

87506 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Fig.

7 - Typical Resistance Junction to Ambient vs. Copper Pad Areas PACKAGE OUTLINE DIMENSIONS in inches (millimeters)

0 10

20 30

40 50

60 70

80 0

1 2

3 4

5 6

7 8

9 10 Thermal Re s i s tance ( ° C/W) Copper Pad Areas (cm2) Epoxy printed circuit board FR4 copper thickness =

70 μm S (cm2) (9.40) (8.60) 0.370 0.339 (6.72) (6.48) 0.265 0.255 (6.32) (6.08) 0.249 0.239 (0.70) (0.30) 0.028 0.012 (0.41) (0.25) 0.016 0.010 (1.40) (1.20) (0.20) (0.00) 0.008 0.000 (1.40) (1.00) 0.055 0.039 (5.70) (5.30) 0.224 0.209 MIN. 0.240 (6.10) MIN. 0.235 (5.97) REF. 0.386 (9.80) MIN. 0.075 (1.90) MIN. 0.055 (1.40) NOM. 0.090 (2.29) 0.055 0.047 0.090 (2.29) NOM. 0.180 (4.57) NOM. (0.90) (0.70) 0.035 0.028 NOM. 0.205 (5.20) Mounting Pad Layout SlimDPAK (TO-252AE) Legal Disclaimer Notice www.vishay.com Vishay Revision: 01-Jan-2019