PDF《STPS20H100C》

2 2 Figure 5. Relative variation of thermal impedance junction to case versus pulse duration (per diode) 1E-2 1E-1 1E+0 1E+1 0.0 0.2 0.4 0.6 0.8 1.0 Z /R th(j-c) th(j-c) t (s) p Single pulse TO-220FPAB Figure 6. Reverse leakage current versus reverse voltage applied (typical values, per diode) I (?A) R

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100 1E-2 1E-1 1E+0 1E+1 1E+2 1E+3 1E+4 V (V) R T =125°C j T =150°C j T =100°C j T =25°C j STPS20H100C Characteristics (curves) DS1216 - Rev

9 page 4/18 Figure 7. Junction capacitance versus reverse voltage applied (typical values, per diode)

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1000 C(pF) V (V) R F=1MHz V =30mV T =25°C OSC RMS j Figure 8. Forward voltage drop versus forward current (maximum values, per diode) I (A) FM 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.1 1.0 10.0 100.0 V (V) FM T =125°C (typical values) j T =25°C j T =125°C j T =150°C (typical values) j Figure 9. Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, eCu =

35 ?m) (D?PAK)

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35 40 Rth(j-a)(°C/W) SCu(cm?) STPS20H100C Characteristics (curves) DS1216 - Rev

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2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK? packages, depending on their level of environmental compliance. ECOPACK? specifications, grade definitions and product status are available at: www.st.com. ECOPACK? is an ST trademark. STPS20H100C Package information DS1216 - Rev

9 page 6/18 2.1 D?PAK package information ? Cooling method: by conduction (C) ? Epoxy meets UL 94,V0 Figure 10. D?PAK package outline STPS20H100C D?PAK package information DS1216 - Rev

9 page 7/18 Table 4. D?PAK package mechanical data Ref. Dimensions Millimeters Inches Min. Max. Min. Max. A 4.36 4.60 0.172 0.181 A1 0.00 0.25 0.000 0.010 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.38 0.69 0.015 0.027 c2 1.19 1.36 0.047 0.053 D 8.60 9.35 0.339 0.368 D1 6.90 8.00 0.272 0.311 D2 1.10 1.50 0.043 0.060 E 10.00 10.55 0.394 0.415 E1 8.10 8.90 0.319 0.346 E2 6.85 7.25 0.266 0.282 e 2.54 typ. 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.90 0.097 0.112 L 1.90 2.79 0.075 0.110 L1 1.27 1.65 0.049 0.065 L2 1.30 1.78 0.050 0.070 R 0.4 typ. 0.015 V2 0° 8° 0° 8° STPS20H100C D?PAK package information DS1216 - Rev

9 page 8/18 Figure 11. D?PAK Recommended footprint 16.90 12.20 9.75 3.50 5.08 1.60 2.54 STPS20H100C D?PAK package information DS1216 - Rev

9 page 9/18 2.2 I?PAK package information ? Cooling method: by conduction (C) ? Epoxy meets UL 94,V0 Figure 12. I?PAK package outline STPS20H100C I?PAK package information DS1216 - Rev

9 page 10/18 Table 5. I?PAK package mechanical data Ref. Dimensions Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.044 0.067 c 0.49 0.70 0.019 0.028 c2 1.23 1.32 0.048 0.052 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 E 10.00 10.40 0.394 0.409 L 13.00 14.00 0.512 0.551 L1 3.50 3.93 0.138 0.155 L2 1.27 1.40 0.050 0.055 STPS20H100C I?PAK package information DS1216 - Rev

9 page 11/18 2.3 TO-220AB package information ? Cooling method: by conduction (C) ? Epoxy meets UL 94,V0 ? Recommended torque value: 0.55 N・m ? Maximum torque value: 0.7 N・m Figure 13. TO-220AB package outline STPS20H100C TO-220AB package information DS1216 - Rev

9 page 12/18 Table 6. TO-220AB package mechanical data Ref. Dimensions Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.240 0.035 b1 1.14 1.55 0.045 0.061 c 0.48 0.70 0.019 0.028 D 15.25 15.75 0.600 0.620 D1 1.27 typ. 0.050 typ. E 10.00 10.40 0.394 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.260 J1 2.40 2.72 0.094 0.107 L 13.00 14.00 0.512 0.551 L1 3.50 3.93 0.138 0.155 L20 16.40 typ. 0.646 typ. L30 28.90 typ. 1.138 typ. θP 3.75 3.85 0.148 0.152 Q 2.65 2.95 0.104 0.116 STPS20H100C TO-220AB package information DS1216 - Rev