编辑: 过于眷恋 | 2019-09-27 |
条件设订: "设置内容",,
,,
,,
"资格内容",,
"A级",,
,,
,"B级",,
,,
,"C级",,
,,
条件",,
,"需求(Y/N)",,
"条件",,
,"需求(Y/N)",,
"条件",,
,"需求(Y/N)", "数量条件","2.机具设备(自备)",,
"1","YEDBC","数位电表","","Y/N","",,
,"Y"Y"Y", ,,
,"2","YED60","数位示波器","","Y/N","",,
,"Y"Y"Y", ,,
,"3","YEDA4","高斯计","","Y/N","",,
,"Y"N"N", ,,
,"4","YEDB4","精密水平校正仪","","Y/N","",,
,"Y"Y"N", ,,
,"5","YED30","精密AC/DC电源供应器","","Y/N","",,
,"Y"Y"N", ,,
,"6","YEDAE","晶圆传送校正机具","","Y/N","",,
,"Y"N"N", ,,
,"7","YEDAD","晶圆盒定位传送校正机具","","Y/N","",,
,"Y"N"N", ,,
,"8","YEDB5","精密数位式游标卡尺","","Y/N","",,
,"Y"Y"N", ,,
,"9","YECDE","无尘室重力承载器","","Y/N","",,
,"Y"N"N", ,,
,"10","YED17","精密高阻计","","Y/N","",,
,"Y"N"N", ,"3.软体设备",,
"1","YF015","绘图软体","AUTOCAD或其他绘图软体(具版权)","Y/N","",,
,"Y"Y"Y", ,,
,"2","YF001","进度管制软体","Office相关作业软体(具版权)或其他进度管制软体","Y/N","",,
,"Y"Y"Y", ,,
,"3","YF039","专业软体","须具有半导体业主机台设备或附属设备原厂软体技术认证","Y/N","具原厂软体技术认证",,
,"Y",,
"具原厂软体技术认证",,
,"Y",,
"具原厂软体技术认证",,
,"Y", ,"4.协力厂商",,
"1","YG054","半导体设备维修厂商","","Y/N","下包商家数(5家)",,
,"Y",,
"下包商家数(3家)",,
,"Y",,
"下包商家数(1家)",,
,"Y", "素质条件","5.管理人力","专案","1","XAA01","专案经理","须具有相关半导体设备管理经验及英文简报能力","Y/N","相关工程经验3年",,
,"Y",,
"相关工程经验2年",,
,"Y",,
"相关工程经验1年",,
,"Y", ,,
,"2","XA006","工地负责人","1.须具有主机台设备或附属设备原厂软硬体技术与品质与业务管理相关经验2.具业界承揽经验","Y/N","相关工程经验3年",,
,"Y",,
"相关工程经验2年",,
,"Y",,
"相关工程经验1年",,
,"Y", ,,
"工安","1","XBZ03","劳工安全卫生业务主管","须经劳工安全卫生业务主管训练取得结业证书或相等资格","Y/N","丙种(含)以上",,
,"Y",,
"丙种(含)以上",,
,"Y",,
"丙种(含)以上",,
,"Y", ,,
"品管","1","XCX01","品质管理人员","须具有施工品质管理相关经验/阅读图面能力","Y/N","相关工程经验3年",,
,"Y",,
"相关工程经验2年",,
,"Y",,
"相关工程经验1年",,
,"Y", ,,
,"2","XCY01","材控人员","1.须熟悉材料规格及相关采购经验并负责材料库存控管2.需24hroncall","Y/N","相关工程经验3年",,
,"Y",,
"相关工程经验2年",,
,"Y",,
"相关工程经验1年",,
,"Y", ,"6.技术人力",,
"1","XB043","主要技术人员","须具有主机台设备或附属设备,原厂软硬体技术认证","Y/N","相关工程经验3年",,
,"Y",,
"相关工程经验2年",,
,"Y",,
"相关工程经验1年",,
,"Y", ,"7.训练管理",,
"1","XCA02","训练教材","须提供相关人力训练教材或认证","Y/N","",,
,"Y"Y"Y", ,,
,"2","XCC01","训练教材(工安)","须提供年度工安训练教材","Y/N","",,
,"Y"Y"Y", ,,
,"3","XC002","品质手册","ISO系列或OHSAS认证或业主认可之品管手册","Y/N","ISO系列或OHSAS认证",,
,"Y",,
"ISO系列或OHSAS认证",,
,"Y",,
"业主认可之品管手册",,
,"Y", "二.汇总表: "设置内容",,
,,
,,
"资格内容",,
"A级",,
,,
,"B级",,
,,
,"C级",,
,,
1","2","3","4","5","1","2","3","4","5","1","2","3","4","5" "数量等级","1.厂商规模",,
"1","YD002","资本额","公司设立登记表或变更登记表择一载定资本额","万元","20000","12000","8000","4000","2000","20000","12000","8000","4000","2000","20000","12000","8000","4000","2000" ,,
,"2","YD003","厂房(含租用)","室内厂房+材料放置场(各楼层合计)","M2","450","350","250","150","100","450","350","250","150","100","450","350","250","150","100" ,,
,"3","YD005","承揽实绩","该专业类别近2年平均每月承揽金额","万元/月","4300","3800","3500","2000","800","4300","3800","3500","2000","800","4300","3800","3500","2000","800" ,,
,"4","YD014","固定人力(公司所有员工且须有劳保证明)","投保劳工保险","人","100","50","20","10","5","100","50","20","10","5","100","50","20","10","5" ,"2.机具设备",,
"1","YEDBC","数位电表","","套","2","2","1","1","1","2","2","1","1","1","2","2","1","1","1" ,,
,"2","YED60","数位示波器","","套","2","2","1","1","1","2","2","1","1","1","2","2","1","1","1" ,,
,"3","YEDA4","高斯计","","套","2","2","1","1","1","0","0","0","0","0","0","0","0","0","0" ,,
,"4","YEDB4","精密水平校正仪","","套","2","2","1","1","1","2","2","1","1","1","0","0","0","0","0" ,,
,"5","YED30","精密AC/DC电源供应器","","套","2","2","1","1","1","2","2","1","1","1","0","0","0","0","0" ,,
,"6","YEDAE","晶圆传送校正机具","","套","2","2","1","1","1","0","0","0","0","0","0","0","0","0","0" ,,
,"7","YEDAD","晶圆盒定位传送校正机具","","套","2","2","1","1","1","0","0","0","0","0","0","0","0","0","0" ,,
,"8","YEDB5","精密数位式游标卡尺","","套","2","2","1","1","1","2","2","1","1","1","0","0","0","0","0" ,,
,"9","YECDE","无尘室重力承载器","","套","2","2","1","1","1","0","0","0","0","0","0","0","0","0","0" ,,
,"10","YED17","精密高阻计","","套","2","2","1","1","1","0","0","0","0","0","0","0","0","0","0" ,"3.软体设备",,
"1","YF015","绘图软体","AUTOCAD或其他绘图软体(具版权)","套","1","1","1","1","1","1","1","1","1","1","1","1","1","1","1" ,,
,"2","YF001","进度管制软体","Office相关作业软体(具版权)或其他进度管制软体","套","1","1","1","1","1","1","1","1","1","1","1","1","1","1","1" ,,
,"3","YF039","专业软体","须具有半导体业主机台设备或附属设备原厂软体技术认证","套","1","1","1","1","1","1","1","1","1","1","1","1","1","1","1" ,"4.协力厂商",,
"1","YG054","半导体设备维修厂商","","家","3","2","1","1","1","3","2","1","1","1","3","2","1","1","1" "素质等级","5.管理人力","专案","1","XAA01","专案经理","须具有相关半导体设备管理经验及英文简报能力","人","1","1","1","1","1","1","1","1","1","1","1","1","1","1","1" ,,
,"2","XA006","工地负责人","1.须具有主机台设备或附属设备原厂软硬体技术与品质与业务管理相关经验2.具业界承揽经验","人","3","2","2","1","1","3","2","2","1","1","3","2","2","1","1" ,,
"工安","1","XBZ03","劳工安全卫生业务主管","须经劳工安全卫生业务主管训练取得结业证书或相等资格","人","3","2","2","1","1","3","2","2","1","1","3","2","2","1","1" ,,
"品管","1","XCX01","品质管理人员","须具有施工品质管理相关经验/阅读图面能力","人","1","1","1","1","1","1","1","1","1","1","1","1","1","1","1" ,,
,"2","XCY01","材控人员","1.须熟悉材料规格及相关采购经验并负责材料库存控管2.需24hroncall","人","3","2","1","1","1","3","2","1","1","1","3","2","1","1","1" ,"6.技术人力",,
"1","XB043","主要技术人员","须具有主机台设备或附属设备,原厂软硬体技术认证","人","3","2","2","1","1","3","2","2","1","1","3","2","2","1","1" ,"编辑委员设订说明: ,,
"1.涵盖工作围:",,
,,
"针对半导体厂主制程机台设备进行下列作业,以符合产线需求.(1)故障排除:机台发生异常,因专利技术,须由厂商进行故障排除或参数校正.(2)机构改造:配合机台良率品质改善,机台内部机构须由厂商配合进行改造.(3)软体升级:配合机台升级、改造或IT&EQA系统变更,机台应用软体须由厂商配合升级软体功能. ,,
"2.A.B.C级分类主要项目及原因",,
,,
"A为原厂B为代理商C为技术经业主认可之厂商"