PDF《典型工作电路》

典型工作电路 19-6266;

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4/12 备有评估板本文是英文数据资料的译文,文中可能存在翻译上的不准确或错误.

如需进一步确认,请在您的设计中参考英文资料. 有关价格、供货及订购信息,请联络Maxim亚洲销售中心:10800

852 1249 (北中国区),10800

152 1249 (南中国区), 或访问Maxim的中文网站:china.maximintegrated.com. 定购信息在数据资料的最后给出. 相关型号以及配合该器件使用的推荐产品,请参见:china.maximintegrated. com/MAX15104.related. 概述 MAX15104是一款小尺寸、低压差、线性稳压器,优化用 于网络、数据通信和服务器应用.稳压器可从1.7V至5.5V 电源输入产生高达2A的电流,电压输出精度为±1.6%.输 出可调至最低0.6V,满载时确保压差小于150mV.内部p 沟道开关带有折返限流和热关断保护. MAX15104具有外部旁路输入,以减小噪声.该旁路输入 也作为软启动控制,包括使能输入和电源就绪输出,以进 行电源排序控制. MAX15104采用1.6mm?x?2.7mm?WLP封装,-40°C至+85°C? 工作温度范围. 应用 网络 电信/数据通信 服务器 基站 PLL电源 特性 S 1.7V至5.5V工作范围 S 输出2A电流时压差低至150mV S 在输入电源、负载和温度变化范围内,保持±1.6%输出 精度 S 70dB PSRR @ 500kHz S 输出电压:0.6V至5.2V可调 S 折返限流保护 S 热关断保护 S 15μVRMS (典型值)低噪声 S 小尺寸1.6mm x 2.7mm WLP封装 R1

0 TO 4.6kI R2 600I OUT FB PG EN IN COUT 22?F CIN 2.2?F INPUT (1.7V TO 5.5V) POWER-GOOD OUTPUT CSS 100nF SS_BYP GND OUTPUT (0.6V TO VIN - 200mV) MAX15104 MAX15104 小尺寸、2A、低压差、线性稳压器, 采用2.7mm x 1.6mm封装 Maxim Integrated ??

2 IN, EN, PG, SS_BYP, FB to GND 0.3V to +6V OUT to GND.0.3V to (VIN + 0.3V) OUT Short Circuit.Continuous Continuous Power Dissipation (TA = +70NC) WLP (derate 19.2mW/NC above +70NC)1538mW Operating Temperature Range 40NC to +85NC Storage Temperature Range 65NC to +150NC Junction Temperature 150NC Soldering Temperature (reflow) (Note 1)260NC WLP Junction-to-Ambient Thermal Resistance (qJA)30°C/W Absolute Maximum Ratings Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to china.maximintegrated.com/thermal-tutorial. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional opera- tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 2) Electrical Characteristics (VIN = 3.3V, VOUT = 1.5V, VEN = VIN, IOUT = 100mA, CIN = 2.2?F, COUT = 22?F, TA = TJ = -40NC to +85NC, typical values are at TA = +25NC, unless otherwise noted.) (Note 3) Note 1: The WLP package is constructed using a unique set of package techniques that impose a limit on the thermal profile. The device can be exposed during board-level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification JEDEC 020A, paragraph 7.6, Table

3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed. PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS IN Input Voltage Range VIN 1.7 ? 5.5 V Input Undervoltage Lockout VIN_UV VIN rising 2.03 2.099 V Input Undervoltage Lockout Hysteresis VIN_UV_HYS