编辑: kr9梯 2014-10-09

11/08) Maxim Integrated Page

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9 8 元件列表 DESIGNATION QTY DESCRIPTION C1

1 150μF ± 20% Tantalum Capacitor (B-Case) C2

1 22μF ± 20% Ceramic Capacitor (0805) C3, C19, C22

3 0.1μF ± 10% Ceramic Capacitor (0603) C4, C6, C13, C21, C24, C28, C29, C31, C36, C38-C40, C42

13 0.1μF ± 10% Ceramic Capacitor (0402) C5

1 0.047μF ± 10% Ceramic Capacitor (0402) C7, C9, C12, C17, C18, C32, C43

7 1μF ± 10% Ceramic Capacitor (0402) C8, C11

2 2.2μF ± 10% Ceramic Capacitor (0402) C10

1 10μF ± 20% Ceramic Capacitor (0603) C14, C37

2 0.022μF ± 10% Ceramic Capacitor (0402) C15, C16, C35

3 10μF ± 10% Ceramic Capacitor (0805) C20

1 4.7μF ± 10% Ceramic Capacitor (0805) C23

1 1pF ± 10% Ceramic Capacitor (0402) C25, C26

2 470pF ± 10% Ceramic Capacitor (0402) C27

1 0.47μF ± 10% Ceramic Capacitor (0402) C30

1 Short (0402) C33, C34

2 Open (0402) J4, J5

2 PCB Mount SMA Connector, Tab Contact JU1, JU16, JU20

2 2-Pin Header L1-L3, L5

4 600Ω Ferrite Bead (0603) Murata BLM18HG601SN1 L4

1 33μH Inductor Coilcraft DO1608 L6, L7

2 2.2μH Inductor Sumida CDRH2D18HP-2R2 LED1

1 Red LED Q1

1 NPN Transistor Zetex FMMT491A R1, R7

2 47.5kΩ ±1% Resistor (0402) R2

1 100kΩ ±1% Resistor (0402) R3

1 20.0kΩ ±1% Resistor (0402) R4, R30-R33

5 50kΩ Variable Resistor R5

1 0.1Ω ±1% Resistor (1206) R6

1 243kΩ ±1% Resistor (0402) R8

1 1.00kΩ ±1% Resistor (0402) R9

1 10Ω ±1% Resistor (0402) R10, R11

2 2.21kΩ ±1% Resistor (0402) R12, R13

2 47.5Ω ±1% Resistor (0402) R14

1 75Ω ±5% Resistor (0402) R15, R17, R20, R55

4 0Ω ±5% Resistor (0402) R16

1 27Ω ±5% Resistor (0402) R18

1 49.9Ω ±1% Resistor (0402) R21, R26

2 0Ω ±5% Resistor (0805) R22

1 200Ω ±1% Resistor (0402) R23

1 511Ω ±1% Resistor (0402) R24

1 1.5kΩ ±1% Resistor (0402) R25

1 4.32kΩ ±1% Resistor (0402) R27

1 Open (0402) U4

1 MAX3735ATEG U5

1 MAX8521ETP U6

1 MAX4238AUT-T U7

1 Open (MSA TOSA)

1 HFRD21-1 PCB

9 原理图 注意:每块电路板的 VSHDN 至VCC 之间加入一个 4.7kΩ电阻,JU1 上没有放置跳接器时,将其拉高 (使能 TEC 控制器).该电阻没有出现在原理图和布板文件中. 参考设计 HFRD-21.0 (Rev. 4;

11/08) Maxim Integrated Page

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9 10 PCB 布局 第1层元件放置指南 第4层元件放置指南

11 板层剖面图 参考设计 HFRD-21.0 (Rev. 4;

11/08) Maxim Integrated Page

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9 HFRD-21.0 制冷 TOSA 评估板含有电阻受控的 传输线.PCB 由FR4 (~ 4.5 的介质常数)和1oz 铜箔构成. 板层剖面图 Maxim 不对 Maxim 产品以外的任何电路使用负责,也不提供其专利许可.Maxim 保留在任何时间、没有任何通报的前提下修改产品资料 和规格的权利. 单端 耦合 A 27mil 12mil B > 50mil 7mil C 15mil 15mil D 根据需要确定 根据需要确定 A B A CORE PREPREG PREPREG C D C

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