PDF《S-58LM20A 系列》

0 20

200 1.8 0.6 0.4

0 240 V OUT [V] t [s]

80 140 0.2 1.6

60 0.8 1.0 1.2 1.4

40 100

120 220

160 160 SC-82AB SNT-4A WLP-4B

0 5 1.8 0.6 0.4

0 45 V OUT [V] t [s]

15 25 0.2 1.6

10 0.8 1.0 1.2 1.4

20 40

30 35 SC-82AB SNT-4A WLP-4B 8. 启动响应 VOUT t (50??s / div.) Ta = 25?C, CL = 100pF, RL =

10 M?

1 V / div. GND

1 V / div. GND VDD (= 5.5 V) Ta = 25?C, CL = 100pF, RL =

10 M? VDD (= 2.4 V) VOUT t (50??s / div.)

1 V / div. GND

1 V / div. GND CMOS温度传感器IC Rev.3.1_02 S-58LM20A系列

17 ? 标记规格 1. SC-82AB (1) (2) (3)

1 2

3 4 Top view (1)~(3) : 产品简称(请参照产品名和产品简称的对照表) 产品名和产品简称的对照表 产品名 产品简称 (1) (2) (3) S-58LM20A-N4T1x D R E 备注 1. x: G 或U2. 用户需要 Sn 100%、无卤素产品时,请选择环保标记为 U 的产品. 2. SNT-4A

1 2

4 3 Top view (1) (2) (3) (1)~(3) : 产品简称(请参照产品名和产品简称的对照表) 产品名和产品简称的对照表 产品名 产品简称 (1) (2) (3) S-58LM20A-I4T1U D R E 3. WLP-4B

1 2

3 4 Top view (1) (2) (1)~(2) : 批号 No. TITLE UNIT ANGLE ABLIC Inc. 0.3 +0.1 -0.05 0.4 +0.1 -0.05 0.05

1 2

4 3 0.16 +0.1 -0.06 1.3±0.2 2.0±0.2 No. NP004-A-P-SD-2.0 SC82AB-A-PKG Dimensions NP004-A-P-SD-2.0 mm No. TITLE UNIT ANGLE ABLIC Inc. 1.1±0.1 0.2±0.05 4.0±0.1 2.0±0.05 4.0±0.1 2.2±0.2 (0.7) No. NP004-A-C-SD-3.0 NP004-A-C-SD-3.0 SC82AB-A-Carrier Tape Feed direction

1 2

3 4 ?1.05±0.1 ?1.5 +0.1 -0 mm No. TITLE UNIT ANGLE ABLIC Inc. QTY. 3,000 NP004-A-R-SD-1.1 SC82AB-A-Reel mm No. NP004-A-R-SD-1.1 12.5max. 9.0±0.3 ?13±0.2 (60°) (60°) Enlarged drawing in the central part No. TITLE ANGLE UNIT ABLIC Inc. mm SNT-4A-A-PKG Dimensions PF004-A-P-SD-6.0 No. PF004-A-P-SD-6.0 1.2±0.04 0.65 0.2±0.05 0.48±0.02 0.08 +0.05 -0.02

1 2

3 4 No. TITLE ANGLE UNIT ABLIC Inc. mm PF004-A-C-SD-2.0 SNT-4A-A-Carrier Tape Feed direction 4.0±0.1 2.0±0.05 4.0±0.1 ?1.5 +0.1 -0 ?0.5 1.45±0.1 0.65±0.05 0.25±0.05

1 2

3 4 No. PF004-A-C-SD-2.0 +0.1 -0 No. TITLE ANGLE UNIT ABLIC Inc. 12.5max. 9.0±0.3 ?13±0.2 (60°) (60°) QTY. 5,000 No. PF004-A-R-SD-1.0 PF004-A-R-SD-1.0 Enlarged drawing in the central part mm SNT-4A-A-Reel No. TITLE ANGLE UNIT ABLIC Inc. mm SNT-4A-A -Land Recommendation PF004-A-L-SD-4.1 No. PF004-A-L-SD-4.1 0.3 0.35 0.52 1.16 0.52 Caution 1. Do not do silkscreen printing and solder printing under the mold resin of the package. 2. The thickness of the solder resist on the wire pattern under the package should be 0.03 mm or less from the land pattern surface. 3. Match the mask aperture size and aperture position with the land pattern. 4. Refer to SNT Package User'

s Guide for details. 1. (0.25 mm min. / 0.30 mm typ.) 2. (1.10 mm ~ 1.20 mm)

1 2 0.03 mm........