PDF《的±1°C 远程和本地温度传感器》

3 2 Copyright ? 2013C2014, Texas Instruments Incorporated TMP451 www.ti.com.cn ZHCSB68A CJUNE 2013CREVISED DECEMBER

2014 5 Pin Configuration and Functions DQF Package 8-Pin WSON Top View Pin Functions PIN TYPE DESCRIPTION NAME NO. Interrupt or SMBus alert output. Can be configured as a second THERM output. Open-drain;

requires ALERT/THERM2

6 Digital output pullup resistor to voltage between 1.7 V and 3.6 V. DC

3 Analog input Negative connection to remote temperature sensor. D+

2 Analog input Positive connection to remote temperature sensor. GND

5 Ground Supply ground connection. Serial clock line for SMBus. Input;

requires pullup resistor to voltage between 1.7 V and 3.6 V if driven SCL

8 Digital input by open-drain output. Bidirectional digital SDA

7 Serial data line for SMBus. Open-drain;

requires pullup resistor to voltage between 1.7 V and 3.6 V. input-output Thermal shutdown or fan-control pin. Open-drain;

requires pullup resistor to voltage between 1.7 V and THERM

4 Digital output 3.6 V. V+

1 Power supply Positive supply voltage, 1.7 V to 3.6 V.

6 Specifications 6.1 Absolute Maximum Ratings Over operating free-air temperature range, unless otherwise noted.(1) MIN MAX UNIT Power supply V+ C0.3 3.6 V THERM, ALERT/THERM2, SDA and SCL only C0.3 3.6 V Input voltage D+ only C0.3 (V+) + 0.3 V DC only C0.3 0.3 V Input current

10 mA Operating temperature C55

127 °C Junction temperature (TJmax)

150 °C Tstg Storage temperature C60

150 °C (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101, all ±750 pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Copyright ? 2013C2014, Texas Instruments Incorporated

3 TMP451 ZHCSB68A CJUNE 2013CREVISED DECEMBER

2014 www.ti.com.cn 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage 1.7 3.3 3.6 V TA Operating free-air temperature C40

125 °C 6.4 Thermal Information TMP451 THERMAL METRIC(1) DQF UNIT

8 PINS RθJA Junction-to-ambient thermal resistance 171.3 RθJC(top) Junction-to-case (top) thermal resistance 81.4 RθJB Junction-to-board thermal resistance 137.9 °C/W ψJT Junction-to-top characterization parameter 3.9 ψJB Junction-to-board characterization parameter

140 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 6.5 Electrical Characteristics At TA = C40°C to 125°C and V+ = 3.3 V, unless otherwise noted. PARAMETER CONDITIONS MIN TYP MAX UNIT TEMPERATURE ERROR TA = 0°C to 70°C ±0.25 ±1 °C TELOCAL Local temperature sensor TA = C40°C to 125°C ±1 ±2 °C TA = 0°C to 70°C, TD = C55°C to 150°C ±0.25 ±1 °C TEREMOTE Remote temperature sensor(1) TA = C40°C to 100°C, TD = C55°C to 150°C ±1 ±2 °C TA = C40°C to 125°C, TD = C55°C to 150°C ±2 ±4 °C Remote temperature sensor versus supply V+ = 1.7 V to 3.6 V ±0.1 ±0.25 °C/V (local or remote) TEMPERATURE MEASUREMENT Conversion time One-Shot mode, local and remote total