PDF《产品规格书》

5 cycles 试验周期:5 个周期 (2) Standard condition after test:1h 试验后的放置条件:1 小时 Temperature 温度 Duration of test 持续时间

1 cycle 一次循环 20±5℃ 1h -20±2℃ 1h 20±5℃ 1h 80±5℃ 1h THERE SHALL BE NO DAMAGE ONAPPEARANCE. MECHANICAL AND ELECTRICAL CHARACTERISTICS SHALL BE SATISFIED. 外观无异常,满足于机 械,电气性能 8.4 Soldering heat test 耐焊接热 Soldering area: T/2 of PWB thickness. (PWB: T=1.6mm) 焊接面积:印刷基板的 1/2 厚度处 Soldering temperature: 260±5℃ Soldering time: 3±0.5s 焊接温度:260±5℃ 焊接时间:3±0.5 秒Appearance: No abnormality. 外观无异常 8.5 SOLDERING CONDITIONS 焊锡条件 1)HAND SOLDERING 手焊: DIVCE 工具:SOLDER IRON 电烙铁. 270℃MAX.,3 sec Max 2) REFLOW SOLDERING 回流焊:≤250℃ THERE SHALL BE NO DAMAGE ONAPPEARANCE MECHANICAL AND ELECTRICAL CHARACTERISTICS SHALL BE SATISFIED 外观无异常,满足于机 械,电气性能

8 8 9. .6 H 耐.7 Salt 盐Recomm (Top View (Single fac All R umidity test 耐湿性 Spray 盐雾测试 ended PCB w) ce board T Right Reserv (1) Temp 温度: (2) relati 相对湿 (3) Dura 持续时 (4) Take 去掉水 (5) Stand 试验后 Apply th 根据下列 (1) Temp 温度: (2) Salt w 盐水浓 (3) Dura 持续时 (4) Afte removed 实验后将 B Layout 推T=(1.6mm) Con ved COPYRI perature :

4 :40±2℃ ve humidit 湿度: 90~9 tion of test 时间:96 off a drop 水珠 dard condi 后的放置条 e following 列条件进行测 perature : : 35±5℃ water dens 浓度: 5± tion:

24 h 时间:

24 er test, th d by runnin 将盐沉积物用 推荐的 PCB P/N: CSL9036 nfidential IGHT Kaihua 40±2℃ ty: 90~95% 95% R.H. t: 96h 小时 water itions after 条件:1 小genvironm ........