PDF《模拟温度传感器》

13 机 机械 械、 、封 封装 装和 和可 可订 订购 购信 信息 息.17

8 Detailed Description

9 8.1 Overview

9 5 修 修订 订历 历史 史记 记录 录注:之前版本的页码可能与当前版本有所不同. Changes from Revision B (May 2014) to Revision C Page ? 已删除 有关 TO-126 封装的所有叙述

1 ? Added TO-92 LPM pin configuration graphic

3 ? Changed Handling Ratings to ESD Ratings and moved Storage Temperature to Absolute Maximum Ratings table.4 ? Changed KV to V

4 ? Added layout recommendation for TO-92 LP and LPM packages.15 Changes from Revision A (June 2013) to Revision B Page ? 已更改 数据表流程和版面布局,以符合全新的 TI 标准. 已在整个文档内添加以下章节:应用范围和实施、电源建 议、布局布线、器件和文档支持、机械、封装和可订购信息.1 ? 已添加 TO-92 和TO-126 封装信息.1 ? Changed from 450°C/W to

275 °C/W. New specification is derived using TI '

s latest methodology.5 ? Deleted Note: The input current is leakage only and is highest at high temperature. It is typically only 0.001 ?A. The

1 ?A limit is solely based on a testing limitation and does not reflect the actual performance of the part.6

2 Copyright ? 2013C2015, Texas Instruments Incorporated LMT84, LMT84-Q1 www.ti.com.cn ZHCSCF8C CMARCH 2013CREVISED OCTOBER

2015 Device Comparison Table(1) ORDER NUMBER PACKAGE PIN BODY SIZE (NOM) Mounting Type LMT84DCK SOT (AKA(2) : SC70, DCK)

5 2.00 mm x 1.25 mm Surface Mount LMT84LP TO-92 (AKA(2) : LP)

3 4.3 mm x 3.5 mm Through-hole;

straight leads LMT84LPM TO-92 (AKA(2) : LPM)

3 4.3 mm x 3.5 mm Through-hole;

formed leads LMT84DCK-Q1 SOT (AKA(2) : SC70, DCK)

5 2.00 mm x 1.25 mm Surface Mount (1) For all available packages and complete order numbers, see the Package Option addendum at the end of the data sheet. (2) AKA = Also Known As Comparable Alternative Devices DEVICE NAME AVERAGE OUTPUT SENSOR GAIN POWER SUPPLY RANGE LMT84/LMT84-Q1 C5.5 mV/°C 1.5V to 5.5V LMT85/LMT85-Q1 C8.2 mV/°C 1.8V to 5.5V LMT86/LMT86-Q1 C10.9 mV/°C 2.2V to 5.5V LMT87/LMT87-Q1 C13.6 mV/°C 2.7V to 5.5V

6 Pin Configuration and Functions 3-Pin TO-92 LPM Package 5-Pin SOT (SC70) DCK Package (Top View) 3-Pin TO-92 LP Package Copyright ? 2013C2015, Texas Instruments Incorporated

3 LMT84, LMT84-Q1 ZHCSCF8C CMARCH 2013CREVISED OCTOBER

2015 www.ti.com.cn Pin Functions PIN DESCRIPTION DCK LP LPC LABEL TYPE EQUIVALENT CIRCUIT FUNCTION NUMBER NUMBER NUMBER GND

5 Ground Power Supply Ground GND

1 Ground Power Supply Ground Analog Outputs a voltage which is inversely OUT

3 Output proportional to temperature See Pin See Pin Diagram Diagram VDD

4 Power Positive Supply Voltage GND

2 Ground Power Supply Ground, (direct connection to the back side of the die)

7 Specifications 7.1 Absolute Maximum Ratings(1)(2) MIN MAX UNIT Supply Voltage ?0.3

6 V Voltage at Output Pin ?0.3 (VDD + 0.5) V Output Current -7

7 mA Input Current at any pin(3) -5

5 mA Maximum Junction Temperature (TJMAX)

150 °C Storage temperature Tstg ?65

150 °C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not specified specific performance limits. For specifications and test conditions, see the Electrical Characteristics. The specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. (2) Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging. (3) When the input voltage........