PDF《HDC1010 具有温度传感器的低功耗、高精度数字湿度传感器》

6 Pin Configuration and Functions WLCSP (DSBGA)

8 Pin YPA Top View Pin Functions PIN I/O TYPE(1) DESCRIPTION NAME NO. SCL A1 I Serial clock line for I2C, open-drain;

requires a pull-up resistor to VDD VDD B1 P Supply Voltage ADR0 C1 I Address select pin C hardwired to GND or VDD ADR1 D1 I Address select pin C hardwired to GND or VDD SDA A2 I/O Serial data line for I2C, open-drain;

requires a pull-up resistor to VDD GND B2 G Ground DNC C2 - Do not connect, or, may be connected to GND. DRDYn D2 O Data ready, active low, open-drain. Requires a pull-up resistor to VDD. If not used tie to GND.

4 HDC1010 ZHCSFF0A CMAY 2016CREVISED AUGUST

2016 www.ti.com.cn Copyright ? 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications 7.1 Absolute Maximum Ratings(1) MIN MAX UNIT Input Voltage VDD -0.3

6 V SCL -0.3

6 SDA -0.3

6 DRDYn -0.3

6 ADR0 -0.3 VDD+0.3 ADR1 -0.3 VDD+0.3 Storage Temperature TSTG -65

150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) ±1000 V Charged device model (CDM), per JEDEC specification C500

500 JESD22-C101, all pins (2) ±250 (1) See Figure

2 7.3 Recommended Operating Conditions over operating range (unless otherwise noted) MIN NOM MAX UNIT VDD Supply Voltage 2.7

3 5.5 V TA, Temperature Sensor Ambient Operating Temperature -40

125 °C TA, Humidity Sensor(1) Ambient Operating Temperature -20

70 °C TA, Humidity sensor(1) Functional Operating Temperature -20

85 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information THERMAL METRIC(1) HDC1010 UNIT DSBGA -YPA

8 PINS RθJA Junction-to-ambient thermal resistance 98.0 °C/W RθJC(top) Junction-to-case (top) thermal resistance 0.8 °C/W RθJB Junction-to-board thermal resistance 17.8 °C/W ψJT Junction-to-top characterization parameter 3.7 °C/W ψJB Junction-to-board characterization parameter 17.8 °C/W

5 HDC1010 www.ti.com.cn ZHCSFF0A CMAY 2016CREVISED AUGUST

2016 Copyright ? 2016, Texas Instruments Incorporated (1) Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ >

TA. Absolute Maximum Ratings indicate junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically. (2) Register values are represented as either binary (b is the prefix to the digits), or hexadecimal (0x is the prefix to the digits). Decimal values have no prefix. (3) Limits are ensured by testing, design, or statistical analysis at 30°C. Limits over the operating temperature range are ensured through correlations using statistical quality control (SQC) method. (4) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material. (5) I2 C read/write communication and pull-up resistors current through SCL and SDA not included. (6) Average current consumption while conversion is in progress. (7) This parameter is specified by design and/or characterization and it is not tested in production. (8) The hysteresis value is the difference between an RH measurement in a rising and falling RH environment, at a specific RH point. (9) Actual response times will vary dependent on system thermal mass and air-flow. (10) Time for the RH output to change by 63% of the total RH change after a step change in environmental humidity. (11) Recommended humidity operating range is 10% to 70% RH. Prolonged operation outside this range may result in a measurement offset. The measurement offset will decrease after operating the sensor in this recommended operating range. (12) Drift due to aging effects at typical conditions (30°C and 20% to 50% RH). This value may be impacted by dust, vaporized solvents, out- gassing tapes, adhesives, packaging materials, etc. 7.5 Electrical Characteristics(1) The electrical ratings specified in this section apply to all specifications in this document, unless otherwise noted. TA = 30°C, VDD = 3V, and RH = 40%. PARAMETER TEST CONDITION(2) MIN(3) TYP(4) MAX(3) UNIT POWER CONSUMPTION IDD Supply Current RH measurement, bit