PDF《19-4245; Rev 0; 1/12》

35 温度调节

36 充电保护

36 简化应用电路

37 定购信息

37 芯片信息

37 封装信息

38 修订历史

39 表1. 不同热敏电阻的门限温度

17 表2. 推荐电感

23 表3. 47mΩ及68mΩ检流电阻时的充电电流设置

24 表4. 47mΩ及68mΩ检流电阻时的浮充电流设置

24 表5. 上层I2C寄存器映射

24 表6. CHGCC[4:0]解码

32 表7. DCILMT[5:0]位编码

33 图1. 典型应用电路

15 图2. 锂离子/锂聚合物电池充电曲线

18 图3. 功能状态图

19 图4. JEITA安全区域

22 图5. MAX8971与MAX17047集成

22 Maxim Integrated Products??4 MAX8971 尺寸最小的1.55A 单节Li+电池DC-DC充电器 BYP to PG_0.3V to +22V DC_ to BYP 6V to +0.3V I2CIN, VICHG, IRQB, SDA, SCL to GND.0.3V to +6V BST to AVL.0.3V to +16V BST to LX_0.3V to +6V PVL, SFO, BAT, CS to PG_0.3V to +6V AVL, THM to GND.0.3V to +6V PG_ to GND.0.3V to +0.3V DC_, LX_, CS, BAT, BYP Continuous Current 1.6ARMS Continuous Power Dissipation (TA = +70NC) WLP derate 21.7mW/NC above +70NC 1736mW Operating Temperature Range.40NC to +85NC Junction Temperature.150NC Storage Temperature Range.65NC to +150NC Soldering Temperature (reflow)260NC Absolute Maximum Ratings *This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table

3 for IR/VPR and Convection reflow. Preheating is required. Hand or wave soldering is not allowed. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional opera- tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Electrical Characteristics (VDC = 5V, CBYP = 1FF, IFCHG = 500mA, CAVL = 4.7FF, VTHM = AVL/2, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.) (Note 2) WLP Junction-to-Ambient Thermal Resistance (qJA)46°C/W Junction-to-Case Thermal Resistance (qJC)2°C/W Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to china.maxim-ic.com/thermal-tutorial. Package Thermal Characteristics (Note 1) PARAMETER CONDITIONS MIN TYP MAX UNITS DC INPUT DC Operating Voltage Range 4.0 VOVP V DC Undervoltage Lockout DC rising, 500mV hysteresis 3.6 3.8 4.0 V DC Overvoltage Threshold (VOVP)* DC rising, 250mV hysteresis 7.25 7.5 7.75 V DC OVP Interrupt Delay

16 ms DC to BAT Shutdown Threshold When charging stops, VDC falling, 150mV hysteresis

0 50

100 mV DC Supply Current Charger enabled, VDC = 5.5V

2 mA BST Leakage Current VBST = 5.5V, LX_ = PG_ TA = +25°C 0.01

10 FA TA = -40°C to +85°C 0.1 LX_ Leakage Current VLX_ =

0 or 5.5V TA = +25°C 0.01

10 TA = -40°C to +85°C 0.1 BAT Reverse Leakage Current VDC = 0V, VBAT = 4.2V

1 5 FA Input-Current Limit Range 0.1 1.5 A Maxim Integrated Products??5 MAX8971 尺寸最小的1.55A 单节Li+电池DC-DC充电器 ELECTRICAL CHARACTERISTICS (continued) (VDC = 5V, CBYP = 1FF, IFCHG = 500mA, CAVL = 4.7FF, VTHM = AVL/2, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.) (Note 2) PARAMETER CONDITIONS MIN TYP MAX UNITS Input-Current Limit Accuracy USB 100mA mode