编辑: 苹果的酸 2019-01-08

11 - ns DocID7410 Rev

12 5/14 STS8DNF3LL Electrical characteristics

14 Table 7. Source drain diode Symbol Parameter Test conditions Min. Typ. Max Unit ISD Source-drain current -

8 A ISDM (1) 1. Pulse width limited by safe operating area. Source-drain current (pulsed) -

32 A VSD (2) 2. Pulsed: Pulse duration =

300 μs, duty cycle 1.5% Forward on voltage ISD =

8 A, VGS =

0 - 1.2 V trr Qrr IRRM Reverse recovery time Reverse recovery charge Reverse recovery current ISD =

8 A, VDD =

15 V di/dt =

100 A/μs, Tj =

150 °C (see Figure 16) -

23 17 1.5 ns nC A Electrical characteristics STS8DNF3LL 6/14 DocID7410 Rev

12 2.1 Electrical characteristics (curves) Figure 2. Safe operating area Figure 3. Thermal impedance Figure 4. Output characteristics Figure 5. Transfer characteristics Figure 6. Transconductance Figure 7. Static drain-source on-resistance DocID7410 Rev

12 7/14 STS8DNF3LL Electrical characteristics

14 Figure 8. Gate charge vs. gate-source voltage Figure 9. Capacitance variations Figure 10. Normalized gate threshold voltage vs. temperature Figure 11. Normalized on-resistance vs. temperature Figure 12. Source-drain diode forward characteristics Figure 13. Normalized breakdown voltage vs. temperature Test circuit STS8DNF3LL 8/14 DocID7410 Rev

12 3 Test circuit Figure 14. Switching times test circuit for resistive load Figure 15. Gate charge test circuit Figure 16. Test circuit for inductive load switching and diode recovery times Figure 17. Unclamped Inductive load test circuit Figure 18. Unclamped inductive waveform Figure 19. Switching time waveform AM01468v1 VGS PW VD RG RL D.U.T.

2200 μF 3.3 μF VDD AM01469v1 VDD 47kΩ 1kΩ 47kΩ 2.7kΩ 1kΩ 12V Vi=20V=VGMAX

2200 μF PW IG=CONST 100Ω 100nF D.U.T. VG AM01470v1 A D D.U.T. S B G

25 Ω A A B B RG G FAST DIODE D S L=100μH μF 3.3

1000 μF VDD AM01471v1 Vi Pw VD ID D.U.T. L

2200 μF 3.3 μF VDD DocID7410 Rev

12 9/14 STS8DNF3LL Package mechanical data

14 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK? packages, depending on their level of environmental compliance. ECOPACK? specifications, grade definitions and product status are available at: www.st.com. ECOPACK? is an ST trademark. Table 8. SO-8 mechanical data Dim. mm Min. Typ. Max. A 1.75 A1 0.10 0.25 A2 1.25 b 0.31 0.51 b1 0.28 0.48 c 0.10 0.25 c1 0.10 0.23 D 4.80 4.90 5.00 E 5.80 6.00 6.20 E1 3.80 3.90 4.00 e 1.27 h 0.25 0.50 L 0.40 1.27 L1 1.04 L2 0.25 k 0° 8° ccc 0.10 Package mechanical data STS8DNF3LL 10/14 DocID7410 Rev

12 Figure 20. SO-8 drawing Figure 21. SO-8 recommended footprint (all dimensions are in millimeters) 0016023_G_FU Footprint_0016023_G_FU DocID7410 Rev

12 11/14 STS8DNF3LL Packaging mechanical data

14 5 Packaging mechanical data Table 9. SO-8 tape and reel mechanical data Dim. mm Min. Typ. Max. A

330 C 12.8 13.2 D 20.2 N

60 T 22.4 Ao 8.1 8.5 Bo 5.5 5.9 Ko 2.1 2.3 Po 3.9 4.1 P 7.9 8.1 Packaging mechanical data STS8DNF3LL 12/14 DocID7410 Rev

12 Figure 22. SO-8 tape and reel dimensions DocID7410 Rev

12 13/14 STS8DNF3LL Revision history

14 6 Revision history Table 10. Revision history Date Revision Changes 11-Sep-2006

8 Complete document 15-Nov-2006

9 The document has been reformatted 30-Jan-2007

10 Typo mistake on Table

2 14-Dec-2012

11 C Typo mistake on Table

2 C Updated: Section 4: Package mechanical data 22-Jul-2013

12 C Updated Table 1: Device summary. C Minor text changes. STS8DNF3LL 14/14 DocID7410 Rev

12 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT AUTHORIZED FOR USE IN WEAPONS. NOR ARE ST PRODUCTS DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS;

下载(注:源文件不在本站服务器,都将跳转到源网站下载)
备用下载
发帖评论
相关话题
发布一个新话题