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SPD85582C Will Semiconductor Ltd.

1 Revision 1.1, 2017/11/16 SPD85582C 1-Line, 5000W, TVS Descriptions SPD85582C protect sensitive electronics against voltage transients induced by inductive load switching and lightning. Ideal for the protection of I/O interfaces, VCC bus and other integrated circuits. Features ? For surface mount application ? Excellent clamping capability ? Low profile package ? Fast response time: Typically less than 1.0ps from 0V to 64.4V ? Low inductance ? GPP Mechanical Data ? Case: Molded plastic ? Mounting position: Any ? Weight: 0.21 grams Http//:www.sh-willsemi.com SMC Schematic Diagram XXXX = Date code BFM = Device code Marking (Top View) Order information Device Package Shipping SPD85582C-2/TR SMC 3000/Tape&Reel XXXX 5BGG SPD85582C Will Semiconductor Ltd.

2 Revision 1.1, 2017/11/16 Absolute maximum ratings Notes : 1. Mounted on 5.0mm

2 (0.03mm thick) Copper Pads to each terminal Electrical characteristics (TA=25 o C, unless otherwise noted) Part Number Reverse Stand off Voltage VR (V) Breakdown Voltage VBR@ IT (V) Test Current IT (mA) Maximum Clamping Voltage VC @IPP(V) 1) Maximum Peak Pulse Current IPP (A) 1) Maximum Reverse Leakage IR @ VR(μA) MIN MAX SPD85582C

58 64.4 74.1

1 93.6

53 5 Notes: 1) 10/1000?s waveform Typical characteristics (TA=25 o C, unless otherwise noted) Rating Symbol Value Units Peak Pulse Power on 10/1000?s waveform PPPM

5000 W Junction Temperature TJ -55~150 ℃ Operating Temperature TOP -40~125 ℃ Storage Temperature Range TSTG -55~150 ℃ SPD85582C Will Semiconductor Ltd.

3 Revision 1.1, 2017/11/16 Package outline dimensions (Unit:mm) SMC Recommend land pattern (Unit: mm) Symbol Dimensions in millimeter Min. Typ. Max. A 2.900 -- 3.200 B 6.600 -- 7.110 C 5.590 -- 6.220 D 2.060 -- 2.620 E 0.760 -- 1.520 F - -- 0.203 G 7.750 - 8.130 H 0.125 -- 0.305 Note: This land pattern is for your reference only. Actual pad layouts may vary depending on application.