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13 LatticePower Semiconductor @ HG-3535

5 CONFIDENTIAL http://www.latticepower.com Version:3.0

10、可靠性 Reliability a) 测试和结果 Tests and Results 测试项目 Test Item 参考标准 Reference Standard 测试条件 Test Conditions 测试周期 Test Duration 失效标准 Failure Criteria# 失效数/测试数 Units Failed/Tested 可焊性(回流焊) Solderability(Reflow Soldering) JEITA ED=4701

303 303A Tsld=255±5℃,5sec,Lead-free Solder(Sn-3.0Ag-0.5Cu) 3times #2 0/22 高低温循环 Temperature Cycle JEITA ED=4701

100 105 -40℃(30min)~25℃(5min)~ 85℃(30min)~25℃(5min) 100cycles #1 0/22 高温/低温储存 High/Low Temperature Storage JEITA ED=4701

200 201/ JEITA ED=4701

200 202 TA=120℃/TA=-40℃ 1000h #1 0/22 常温老化 Room Temperature Operating TA=25℃, IF=1500mA Test board:See NOTES below 1000h #1 0/22 高温老化 High Temperature Operating TA=70℃, IF=1500mA Test board: See NOTES below 1000h #1 0/22 高温高湿老化 Temperature Humidity Operating 85℃, RH=85%, IF=1500mA Test board: See NOTES below 1000h #1 0/22

14 LatticePower Semiconductor @ HG-3535

5 CONFIDENTIAL http://www.latticepower.com Version:3.0 b) 失效判定 Failure Criteria 判定 Criteria # 项目 Items 条件 Conditions 失效判定 Failure Criteria #1 正向电压 Forward Voltage (VF) IF >初始值* 1.1 倍>Initial value* 1.1 光通量 Luminous Flux (Φv) IF 1uA #2 回流焊 Solderability - 焊接面积