编辑: bingyan8 2019-07-04

1 VD PGND BANK

2 VOUT BANK

3 fSET MARG0 RUN COMP MPGM PLLIN INTV CC TRACK/SS SGND TJMAX = 125°C, θJA = 15°C/W, θJCbottom = 6°C/W, θJCtop = 16°C/W θJA DERIVED FROM 95mm * 76mm PCB WITH

4 LAYERS WEIGHT = 1.7g Internal Operating Temperature Range (Note 2) E and I Grades.40°C to 125°C MP Grade.55°C to 125°C Junction Temperature.125°C Storage Temperature Range.55°C to 125°C Order Information PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE TYPE MSL RATING TEMPERATURE RANGE (Note 2) DEVICE FINISH CODE LTM4606EV#PBF Au (RoHS) LTM4606V e4 LGA

3 C40°C to 125°C LTM4606IV#PBF Au (RoHS) LTM4606V e4 LGA

3 C40°C to 125°C LTM4606MPV#PBF Au (RoHS) LTM4606V e4 LGA

3 C55°C to 125°C LTM4606EY#PBF SAC305 (RoHS) LTM4606Y e1 BGA

3 C40°C to 125°C LTM4606IY#PBF SAC305 (RoHS) LTM4606Y e1 BGA

3 C40°C to 125°C LTM4606IY SnPb (63/37) LTM4606Y e0 BGA

3 C40°C to 125°C LTM4606MPY#PBF SAC305 (RoHS) LTM4606Y e1 BGA

3 C55°C to 125°C LTM4606MPY SnPb (63/37) LTM4606Y e0 BGA

3 C55°C to 125°C Consult Marketing for parts specified with wider operating temperature ranges. *Device temperature grade is indicated by a label on the shipping container. Pad or ball finish code is per IPC/JEDEC J-STD-609. ? Terminal Finish Part Marking: www.linear.com/leadfree ? Recommended LGA and BGA PCB Assembly and Manufacturing Procedures: www.linear.com/umodule/pcbassembly ? LGA and BGA Package and Tray Drawings: www.linear.com/packaging

3 For more information www.linear.com/LTM4606 Electrical Characteristics The l denotes the specifications which apply over the specified internal operating temperature range, otherwise specifications are at TA = 25°C (Note 2). VIN = 12V, unless otherwise noted. Per typical application (front page) configuration, RFB = 40.2k. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VIN(DC)........

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