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s industry-leading proprietary 32-bit C28x floating-point CPU and features the most flexible and high-precision control peripherals, including ePWMs with fault protection, and encoders and captures―all as implemented by TI'
s TMS320C2000? Piccolo? and Delfino? families. In addition, the C28-CPU has been enhanced with the addition of the VCU instruction accelerator that implements efficient Viterbi, Complex Arithmetic, 16-bit FFTs, and CRC algorithms. A high-speed analog subsystem and supplementary RAM memory is shared, along with on-chip voltage regulation and redundant clocking circuitry. Safety considerations also include Error Correction Code (ECC), parity, and code secure memory, as well as documentation to assist with system-level industrial safety certification. (1) For more information on these devices, see Mechanical, Packaging, and Orderable Information. Device Information(1) PART NUMBER PACKAGE BODY SIZE F28M35H52CRFP HTQFP (144) 20.0 mm * 20.0 mm F28M35H22CRFP HTQFP (144) 20.0 mm * 20.0 mm F28M35M52CRFP HTQFP (144) 20.0 mm * 20.0 mm F28M35M20BRFP HTQFP (144) 20.0 mm * 20.0 mm F28M35E20BRFP HTQFP (144) 20.0 mm * 20.0 mm
3 F28M35H52C, F28M35H22C, F28M35M52C, F28M35M22C, F28M35M20B, F28M35E20B www.ti.com SPRS742J CJUNE 2011CREVISED DECEMBER
2017 Submit Documentation Feedback Product Folder Links: F28M35H52C F28M35H22C F28M35M52C F28M35M22C F28M35M20B F28M35E20B Device Overview Copyright ? 2011C2017, Texas Instruments Incorporated 1.4 Functional Block Diagram A. Some peripherals are not available on the F28M35Mx and F28M35Ex devices. Figure 1-1. Functional Block Diagram
4 F28M35H52C, F28M35H22C, F28M35M52C, F28M35M22C, F28M35M20B, F28M35E20B SPRS742J CJUNE 2011CREVISED DECEMBER
2017 www.ti.com Submit Documentation Feedback Product Folder Links: F28M35H52C F28M35H22C F28M35M52C F28M35M22C F28M35M20B F28M35E20B Table of Contents Copyright ? 2011C2017, Texas Instruments Incorporated Table of Contents
1 Device Overview
1 1.1 Features
1 1.2 Applications.2 1.3 Description.2 1.4 Functional Block Diagram
3 2 Revision History
5 3 Device Comparison
6 3.1 Related Products
9 4 Terminal Configuration and Functions
10 4.1 Pin Diagram
10 4.2 Signal Descriptions.12
5 Specifications
32 5.1 Absolute Maximum Ratings
32 5.2 ESD Ratings C Automotive.32 5.3 ESD Ratings C Commercial.32 5.4 Recommended Operating Conditions.33 5.5 Power Consumption Summary.34 5.6 Electrical Characteristics.39 5.7 Thermal Resistance Characteristics for RFP PowerPAD Package
40 5.8 Thermal Design Considerations
40 5.9 Timing and Switching Characteristics.41 5.10 Analog and Shared Peripherals
60 5.11 Master Subsystem Peripherals.96 5.12 Control Subsystem Peripherals
117 6 Detailed Description
150 6.1 Memory Maps.151 6.2 Identification.161 6.3 Master Subsystem
162 6.4 Control Subsystem.168 6.5 Analog Subsystem
172 6.6 Master Subsystem NMIs.175 6.7 Control Subsystem NMIs
175 6.8 Resets.177 6.9 Internal Voltage Regulation and Power-On-Reset Functionality.182 6.10 Input Clocks and PLLs.185 6.11 Master Subsystem Clocking
195 6.12 Control Subsystem Clocking.200 6.13 Analog Subsystem Clocking.203 6.14 Shared Resources Clocking
203 6.15 Loss of Input Clock (NMI Watchdog Function) ....
203 6.16 GPIOs and Other Pins
205 6.17 Emulation/JTAG
221 6.18 Code Security Module
224 6.19 ?CRC Module.225
7 Applications, Implementation, and Layout ......
227 7.1 TI Design or Reference Design.227
8 Device and Documentation Support.228 8.1 Device and Development Support Tool Nomenclature
228 8.2 Tools and Software