PDF《4GBJ6005 THRU 4GBJ610》

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hygroup.com.tw Features 特征 4GBJ Glass passivated chip 玻璃钝化芯片 Low forward voltage drop 正向压降低 RoHS Ideal for printed circuit board 适用于印刷电路板中 COMPLIANT High surge current capability 高的浪涌能力 Mechanical Data 外观信息 Polarity: Symbol marked on body 极性:标志在产品的本体上 Mounting position: Any 安装位置:任何位置 Applications 应用 General purpose use in AC/DC bridge full wave rectification, for SMPS, lighting ballaster, adapter, etc. 一般应用于交流/直流桥式全波整流,如:开关电源, 照明镇流器、适配器等. Maximum Ratings and Electrical Characteristics 最大额定值及电气特性 Rating at 25℃ ambient temperature unless otherwise specified. 环境温度25℃,除非特别说明. Single phase, half wave, 60Hz, resistive or inductive load. 单相半波, 60Hz, 阻性或感性负载. For capacitive load, derate current by 20%. 对于电容性负载,降低20%的额定电流. 4GBJ 4GBJ 4GBJ 4GBJ 4GBJ 4GBJ 4GBJ

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610 Maximum Repetitive Peak Reverse Voltage 最大重复峰值反向电压 Maximum RMS Voltage 最大有效反向电压 VRMS

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700 V Maximum DC Blocking Voltage 最大直流阻断电压 VDC

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1000 V Maximum Average Forward Rectified Current (with heatsink Note 2) 最大正向平均整流电流 @ TC=100℃ (without heatsink) Peak Forward Surge Current, 8.3mS Single Half Sine-Wave, Superimposed on Rated Load (JEDEC Method) 8.3mS单一正弦半波叠加在额定负载上的浪涌能力(JEDEC方法) I2 t Rating for Fusing (t