PDF《INTEGRATED CIRCUITS》

25 30

38 k? Noise output voltage (RMS value) note

8 ON RS =

0 ? Vno(rms) ?

200 ? ?V ON RS =

10 k? Vno(rms) ?

350 700 ?V mute note

9 Vno(rms) ?

180 ? ?V May

1992 8 Philips Semiconductors Product speci?cation

12 W BTL or

2 x

6 W stereo car radio power ampli?er TDA1519B APPLICATION INFORMATION Fig.3 Stereo application circuit diagram. Fig.4 BTL application circuit diagram. May

1992 9 Philips Semiconductors Product speci?cation

12 W BTL or

2 x

6 W stereo car radio power ampli?er TDA1519B Fig.5 Total quiescent current (Itot) as a function of supply voltage (VP). Fig.6 Output power (Po) as a function of supply voltage (VP) for stereo application at RL =

4 ?, f =

1 kHz. May

1992 10 Philips Semiconductors Product speci?cation

12 W BTL or

2 x

6 W stereo car radio power ampli?er TDA1519B Fig.7 Total harmonic distortion (THD) as a function of output power (Po) for stereo application at RL =

4 ?, f =

1 kHz. Fig.8 Total harmonic distortion (THD) as a function of operating frequency (f) for stereo application at RL =

4 ?, Po =

1 W. May

1992 11 Philips Semiconductors Product speci?cation

12 W BTL or

2 x

6 W stereo car radio power ampli?er TDA1519B PACKAGE OUTLINE UNIT A A max.

2 A3 b1 D1 b2 b c D(1) E(1) Z max. (1) e L P P1 q1 q2 q REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 18.5 17.8 3.7 8.7 8.0 A4 15.8 15.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 6.48 6.20 3.4 3.2 2.54 1.0 5.9 5.7 4.4 4.2 3.9 3.4 15.1 14.9 Q 1.75 1.55 DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 2.75 2.50 SOT110-1 92-11-17 95-02-25

0 5

10 mm scale 0.25 w D E A A c A2

3 A4 q

1 q

2 L Q w M b b1 b2 D1 P q

1 Z e

1 9 P seating plane pin

1 index SIL9MPF: plastic single in-line medium power package with fin;

9 leads SOT110-1 May

1992 12 Philips Semiconductors Product speci?cation

12 W BTL or

2 x

6 W stereo car radio power ampli?er TDA1519B SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code

9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is

260 °C;

solder at this temperature must not be in contact with the joint for more than

5 seconds. The total contact time of successive solder waves must not exceed

5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than

24 V) to the lead(s) of the package, below the seating plane or not more than

2 mm above it. If the temperature of the soldering iron bit is less than

300 °C it may remain in contact for up to

10 seconds. If the bit temperature is between

300 and

400 °C, contact may be up to