PDF《礟G2160T5K》

40 50

20 10

0 C20 C40 C50

30 C10 C30

40 50

20 10

0 C20 C40 C50

30 C10 C30 +20 +12 +16 +24 +28 +8 +35 +30 +25 +20 +15 +10 +5 f = 2.0 GHz Output Return Loss RL out (dB) Frequency f (GHz) INPUT-OUTPUT1 OUTPUT RETURN LOSS vs. FREQUENCY Output Return Loss RL out (dB) Frequency f (GHz) INPUT-OUTPUT2 OUTPUT RETURN LOSS vs. FREQUENCY Output Power P out (dBm) Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER

2 1

3 4

5 1: C18.38 dB 0.5 GHz 2: C22.911 dB 1.0 GHz 3: C28.715 dB 2.0 GHz 4: C30.049 dB 2.5 GHz 5: C25.211 dB 3.0 GHz

2 1

3 4

5 1: C18.646 dB 0.5 GHz 2: C23.332 dB 1.0 GHz 3: C31.078 dB 2.0 GHz 4: C28.398 dB 2.5 GHz 5: C23.042 dB 3.0 GHz Remark The graphs indicate nominal characteristics. Data Sheet PG10635EJ01V0DS

7 ?PG2160T5K MOUNTING PAD DIMENSIONS 6-PIN PLASTIC TSSON (UNIT: mm) 0.31 0.31 0.29 0.29 6C0.22 0.35 0.35 Remark The mounting pad layouts in this document are for reference only. Data Sheet PG10635EJ01V0DS

8 ?PG2160T5K PACKAGE DIMENSIONS 6-PIN PLASTIC TSSON (UNIT: mm) 1.0±0.1 0.35±0.06 0.35±0.06 0.45 ±0.1 0.13±0.07 0.15 +0.07 C0.05 0.23±0.07 0.175±0.075 (Bottom View) (Top View) 1.0±0.1 1.0±0.1 1.0±0.1 0.37+0.03 C0.05 0.15+0.07 C0.05 Data Sheet PG10635EJ01V0DS

9 ?PG2160T5K RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) : 260°C or below Time at peak temperature :

10 seconds or less Time at temperature of 220°C or higher :

60 seconds or less Preheating time at

120 to 180°C : 120±30 seconds Maximum number of reflow processes :

3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 Wave Soldering Peak temperature (molten solder temperature) : 260°C or below Time at peak temperature :

10 seconds or less Preheating temperature (package surface temperature) : 120°C or below Maximum number of flow processes :

1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) :

3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10635EJ01V0DS

10 ?PG2160T5K Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A. The information in this document is current as of Sep........