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60 φ13.0 Harvatek Technical Data Sheet Part No. : HT15-2102UPC Version A.2 Issued date 2009.01.01 Page

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10 HARVATEK OPTO-ELECTRONICS (SHENZHEN) CO., LTD. http://www.harvatek.cn 9. Tape Leader & Trailer Dimensions And Reel 10. Packaging: Label Aluminum moisture-proof bag Desiccant Label Reel Vacuum

10 bags/carton

5 cartons/box Harvatek Technical Data Sheet Part No. : HT15-2102UPC Version A.2 Issued date 2009.01.01 Page

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10 HARVATEK OPTO-ELECTRONICS (SHENZHEN) CO., LTD. http://www.harvatek.cn 11. Reliability Test Classification Test Item Test Condition Reference Standard Reference Standard Operation Life Ta= Under Room Temperature As Per Data Sheet Maximum Rating 1000HRS (-24HRS,+72HRS)*@20mA MIL-STD-750D:1026 MIL-STD-883D:1005 JIS C 7021:B-1 High Temperature, High Humidity Storage IR-Reflow In-Board,

2 Times Ta= 65±5 ,RH=

90 ℃ ?95% 240HRS±2HRS MIL-STD-202F:103B JIS C 7021:B-11 High Temperature Storage Ta= 105±5℃ 1000HRS (-24HRS,+72HRS) MIL-STD-883D:1008 JIS C 7021:B-10 Endurance Test Low Temperature Storage Ta= -55±5℃ 1000HRS (-24HRS,+72H RS) JIS C 7021:B-12 Temperature Cycling 105℃ ? 25℃ ? -55℃ ? 25℃ 30mins 5mins 30mins 5mins

10 Cycles MIL-STD-202F:107D MIL-STD-750D:1051 MIL-STD-883D:1010 JIS C 7021:A-4 Thermal Shock IR-Reflow In-Board,

2 Times

85 ± 5℃ ? -40 ±

5 ℃ ℃ 10mins 10mins

10 Cycles MIL-STD-202F:107D MIL-STD-750D:1051 MIL-STD-883D:1011 Solder Resistance T.sol=

260 ± 5℃

10 ± 1secs MIL-STD-202F:210A MIL-STD-750D:2031 JIS C 7021:A-1 IR-Reflow Normal Process Ramp-up rate(183 to Peak) +3 / second max ℃ ℃ Temp. maintain at 125(±25)

120 seconds max ℃ Temp. maintain above

183 60 ℃ -150 seconds Peak temperature range

235 +5/ ℃ -0℃ Time within 5°C of actual Peak Temperature (tp) 10-30 seconds Ramp-down rate +6 /second max ℃ -------- MIL-STD-750D:2031.2 J-STD-020C IR-Reflow Pb Free Process Ramp-up rate(217 to Peak) +3 / second max ℃ ℃ Temp. maintain at 175(±25)

180 seconds max ℃ Temp. maintain above

217 60 ℃ -150 seconds Peak temperature range

260 +0/ ℃ -5℃ Time within 5°C of actual Peak Temperature (tp) 20-40 seconds Ramp-down rate +6 /second max ℃ -------- MIL-STD-750D:2031.2 J-STD-020C Environmental Test Solderability T.sol=

235 ± 5℃ Immersion rate 25±2.5 mm/sec Coverage 95% of the dipped surface R Immersion time 2±0.5 sec MIL-STD-202F:208D MIL-STD-750D:2026 MIL-STD-883D:2003 IEC

68 Part 2-20 JIS C 7021:A-2 Harvatek Technical Data Sheet Part No. : HT15-2102UPC Version A.2 Issued date 2009.01.01 Page

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10 HARVATEK OPTO-ELECTRONICS (SHENZHEN) CO., LTD. http://www.harvatek.cn 12. Cautions Application 1. A LED is a current-operated device. The slight shift of voltage will cause big change of current, which will damage LEDs. Customer should use resistors in series for the Over-Current-Proof. 2. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an application, it is recommended to use individual resistor separately, as shown in Circuit A below. The brightness of each LED shown in Circuit B might appear difference due to the differences in the I-V characteristics of those LEDs. Circuit model A Circuit model B 3. High temperature may reduce LEDs' intensity and other performances, so keeping it away from heat source to get good performance is necessary. Storage 1.Before opening original package, it is recommended to store them in the following environment: Temperature: 5℃~30 Humidity: 85%RH max. ℃ 2. After opening original package, the storage ambient for the LEDs should be in 5~30°C temperature and 60% or less relative humidity. 3. In order to avoid moisture absorption, it is recommended that the LEDs that out of the original package should be stored in a sealed container with appropriate desiccant, or in desiccators with nitrogen ambient. 4. The LEDs should be used within 168hrs (7 days) after opening the package. Once been mounted, soldering should be quick. 5. If the moisture absorbent material (silica gel) has faded away or the LEDs stored out of original package for more than 168hrs (7 days), baking treatment should be performed using the conditions: 60℃ at least

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