PDF《HMC1058》

80 85

90 7 dBm

9 dBm CONVERSION GAIN (dB) RF FREQUENCY (GHz) MIXERS - SUB HARMONIC - CHIP

4 HMC1058 v01.0413 GaAs MMIC SUB HARMONIC MIXER,

71 -

86 GHz Conversion Gain, Upconverter, LO=9dBm, IF=

4 GHz, USB Input IP3, Upconverter, LO= 9dBm, IF=4 GHz, USB Conversion Gain IFBW vs. LO Power LO=31.25 GHz, USB Conversion Gain IFBW vs. LO Power Downconverter, LO=37.25 GHz, USB Input IP3, Upconverter, LO= 9dBm, IF=4 GHz, LSB Conversion Gain, Upconverter, LO=9dBm, IF=

4 GHz, LSB -30 -25 -20 -15 -10 -5

0 1.5

3 4.5

6 7.5

9 10.5

12 7 dBm

9 dBm CONVERSION GAIN (dB) IF FREQUENCY (GHz) -30 -25 -20 -15 -10 -5

0 1.5

3 4.5

6 7.5

9 10.5

12 7 dBm

9 dBm CONVERSION GAIN (dB) IF FREQUENCY (GHz) -30 -25 -20 -15 -10 -5

60 65

70 75

80 85

90 CG CONVERSION GAIN (dB) RF FREQUENCY (GHz) -30 -25 -20 -15 -10 -5

60 65

70 75

80 85

90 CG CONVERSION GAIN (dB) RF FREQUENCY (GHz)

0 2

4 6

8 10

60 65

70 75

80 85

90 IP3 IP3 (dBm) RF FREQUENCY (GHz)

0 2

4 6

8 60

65 70

75 80

85 90 IP3 IP3 (dBm) RF FREQUENCY (GHz) MIXERS - SUB HARMONIC - CHIP

5 HMC1058 v01.0413 GaAs MMIC SUB HARMONIC MIXER,

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86 GHz RF Return Loss IF Return Loss LO Return Loss LO/IF Isolation vs. LO Drive RF/IF Isolation LO/RF isolation -20 -15 -10 -5

0 50

55 60

65 70

75 80

85 90

95 100 RF-RL RETURN LOSS (dB) RF FREQUENCY (GHz) -30 -25 -20 -15 -10 -5

0 5

2 6

10 14

18 22

26 30

34 38

42 46

50 LO-RL RETURN LOSS (dB) LO FREQUENCY (GHz) -40 -30 -20 -10

0 60

65 70

75 80

85 90 RF/IF Isolation ISOLATION (dB) RF FREQUENCY (GHz)

0 10

20 30

40 30

32 34

36 38

40 42

44 7 dBm

9 dBm ISOLATION (dB) LO FREQUENCY (GHz)

0 10

20 30

40 30

32 34

36 38

40 42

44 LO/RF ISOLATION (dB) LO FREQUENCY (GHz) -35 -30 -25 -20 -15 -10 -5

0 0

5 10

15 20

25 30 IF-RL RETURN LOSS (dB) IF FREQUENCY (GHz) MIXERS - SUB HARMONIC - CHIP

6 HMC1058 v01.0413 GaAs MMIC SUB HARMONIC MIXER,

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86 GHz 2LO/RF Isolation

0 10

20 30

40 50

60 28

30 32

34 36

38 40

42 44 2XLO/RF ISOLATION (dB) LO FREQUENCY (GHz) MIXERS - SUB HARMONIC - CHIP

7 HMC1058 v01.0413 GaAs MMIC SUB HARMONIC MIXER,

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86 GHz Outline Drawing Table 1. Absolute Maximum Ratings RF Input (LO = +9 dBm) +5 dBm LO Drive +20 dBm IF Input +3 dBm Maximum Junction Temperature

170 °C Thermal Resistance (RTH) (junction to die bottom)

555 °C/W Operating Temperature -55 to +85 °C Storage Temperature -65 to

150 °C Table 2. Die Packaging Information [1] Standard Alternate GP-2 (Gel Pack) [2] [1] For more information refer to the Packaging information Document in the Product Support Section of our website. [2] For alternate packaging information contact Hittite Microwave Corporation. NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM]. 2. DIE THICKNESS IS 0.004 3. BOND PADS 1,

2 &

3 are 0.0059 [0.150] X 0.0039 [0.099]. 4. BACKSIDE METALLIZATION: GOLD. 5. BOND PAD METALLIZATION: GOLD. 6. BACKSIDE METAL IS GROUND. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. 8. Overall die size ± 0.002 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS MIXE........