PDF《PCB 印刷电路板设计规範》

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1 PCB 印刷电路板设计规 版本:1发行日期 : 06-11-2003 发行单位 : 技术支援部/PCB 课 昆盈企业股份有限公司 PAGE:

2 印刷电路板设计规目录 1.

PCB定义(Definition) 2. PCB制造流程 3.有关COB LAYOUT ( CHIP ON BOARD ) 4. PCB基板及表面处理 5.为降低PCBA制程不良率,设计应考虑之重点: 6. PCBA零件组装制程需求要项: 7.电气特性与LAYOUT关系 : 昆盈企业股份有限公司 PAGE:

3 1. PCB定义(Definition) 印刷电路板的英文缩写常为P.C.B.,因与公害之一的多氯连苯 P.C.B.( Poly Choloro Benzene) 会混淆,所以改为P.W.B.(Printed Wiring Board)或P.C.Board.(Printed Circuits Board). 1.1. 有关印刷电路板名词 : 1. Artwork : 原稿 2. Base material : 底材 (绝缘材) 3. Substrate : 基质 4. Laminate 积层板 5. Blistering : 泡状鼓起 6. Board thickness : 板厚 7. Bow ( War page) 弯曲 8. Bridge : 桥接 9. Flexible printed wiring board : 可绕性印刷电路板 10. Chamfer : 去角 (金手指) 11. Etching : 腐蚀 12. Legend : 文字记号 13. Post flux : 助焊剂 14. Punching : 冲压 15. Land : 兰岛 ( Pad ) 16. NEMA Standards : 美国国家电器制造业联合会的规格(标准) 17. PTH 孔:Plated-through hole 导通孔 18. NPTH 孔:Non Plated-through hole 非导通孔 ( 如:机构定位用孔壁不吃锡孔 ) 19. Hole Plugging : 塞孔 20.埋通孔(Buried PTH) 21.埋微盲孔(Buried Microvia) 昆盈企业股份有限公司 PAGE:

4 2. PCB 制造流程: 昆盈企业股份有限公司 PAGE:

5 昆盈企业股份有限公司 PAGE:

6 (C). PCB 制造流程图形描述: 昆盈企业股份有限公司 PAGE:

7 3. 有关 COB PCBA ( CHIP ON BOARD ) 3.1. 生产流程: IQC来料检查 PCB清洁 ? 红胶水 贴IC 邦定(Bounding) 功能测试 封胶 烘焙 功能测试 外观检查 包装 QA 出货 3. 2. A suggestion about the PCB design requirement of COB product 1. Owing to the restriction of Bonding Equipment and it's tool, but in order to improve the efficiency of the production, 2. Ensure the quality of product , and reduce the capital of the production in the process of COB fabrication, 3. We have a suggestion about the PCB design requirement of COB product as follows: (a). Requirement about PCB size and PCB connection way ( see attached picture A) Item Size Equipment Influence factor Requirement about PCB size MAX.= 180*135MM US-1800A The Max working width for US-1800A fixture is 135MM The distance between IC position and PCB edge MAX.= 125MM US-1800A The Max. rotation radius is 125MM PCB connection way The IC position is close to PCB as best one can US-1800A In order to reduce centrifugal force when PCB is rotating. 昆盈企业股份有限公司 PAGE:

8 (b). Requirement for the Bonding Golden Finger ( see attached picture B) Item Size Influence factor PCB Bonding golden finger's Size The PCB Bonding golden finger's width : MIN.=0.15MM The diameter of Bonding aluminumline is equal to 1.25mil (32um) PCB Bonding golden finger's Size The PCB Bonding golden finger's length : MIN.=0.5MM Solderable area of steel mouth (2130-2025-L) is as blow: length is equal to 0.381MM width is equal to 0.102MM ( see attached picture C) PCB Bonding golden finger's pitch MIN.=0.15MM When the Bonding lines of IC are more than

60 lines PCB Bonding golden finger's position The PAD position of the PCB Bonding golden finger is close to the correspondingly PAD position of the IC as best one can and they should be in the same direction. In order to prevent short circuit phenomenon The distance requirement between the PAD of the PCB Bonding golden finger and the correspondingly PAD of the IC 1.5 MM