PDF《PCB 印刷电路板设计规範》

< the distance < 3MM DIE distance > 0.8MM When the Bonding lines of IC are more than

60 lines 昆盈企业股份有限公司 PAGE:

9 (c). The requirement for the black glob 1. The black glob's size should follow the IC's size and Bonding lines's area, we do the smallest glob's size as best one can. 2. There is a minimum safety distance between SMT component and the circle edge of the black glob as below. ( PLS see Picture D and Picture E) The height h of SMT component A minimum safety distance Influence factor h