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2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DESCRIPTION CONTINUED The AFE5808 also integrates a low power passive mixer and a low noise summing amplifier to accomplish on- chip CWD beamformer.

16 selectable phase-delays can be applied to each analog input signal. Meanwhile a unique 3rd and 5th order harmonic suppression filter is implemented to enhance CW sensitivity. The AFE5808 is available in a 15mm * 9mm, 135-pin BGA package and it is specified for operation from 0°C to 85°C. It is also pin-to-pin compatible to the AFE5807, AFE5803, and AFE5808A. Figure 1. Block Diagram PACKAGING/ORDERING INFORMATION(1) TRANSPORT MEDIA, PRODUCT PACKAGE TYPE OPERATING ORDERING NUMBER QUANTITY AFE5808 ZCF 0°C to 85°C AFE5808ZCF Tray,

160 (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com.

2 Copyright ? 2010C2012, Texas Instruments Incorporated AFE5808 www.ti.com SLOS688C CSEPTEMBER 2010CREVISED APRIL

2012 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted)(1) VALUE UNIT MAX MIN AVDD C0.3 3.9 V AVDD_ADC C0.3 2.2 V Supply voltage range AVDD_5V C0.3

6 V DVDD C0.3 2.2 V Voltage between AVSS and LVSS C0.3 0.3 V Voltage at analog inputs and digital inputs C0.3 min [3.6,AVDD+0.3] V Peak solder temperature(2)

260 °C Maximum junction temperature (TJ), any condition

105 °C Storage temperature range C55

150 °C Operating temperature range

0 85 °C HBM

2000 V ESD Ratings CDM

500 V (1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied Exposure to absolute maximum rated conditions for extended periods may degrade device reliability. (2) Device complies with JSTD-020D. THERMAL INFORMATION AFE5808 THERMAL METRIC(1) BGA UNITS

135 PINS θJA Junction-to-ambient thermal resistance 34.1 θJCtop Junction-to-case (top) thermal resistance

5 θJB Junction-to-board thermal resistance 11.5 °C/W ψJT Junction-to-top characterization parameter 0.2 ψJB Junction-to-board characterization parameter 10.8 θJCbot Junction-to-case (bottom) thermal resistance n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. RECOMMENDED OPERATING CONDITIONS PARAMETER MIN MAX UNIT AVDD 3.15 3.6 V AVDD_ADC 1.7 1.9 V DVDD 1.7 1.9 V AVDD_5V 4.75 5.5 V Ambient Temperature, TA

0 85 °C Copyright ? 2010C2012, Texas Instruments Incorporated Submit Documentation Feedback

3 Product Folder Link(s): AFE5808 AFE5808 SLOS688C CSEPTEMBER 2010CREVISED APRIL

2012 www.ti.com PINOUT INFORMATION Top View ZCF (BGA-135)

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9 A AVDD INP8 INP7 INP6 INP5 INP4 INP3 INP2 INP1 B CM_BYP ACT8 ACT7 ACT6 ACT5 ACT4 ACT3 ACT2 ACT1 C AVSS INM8 INM7 INM6 INM5 INM4 INM3 INM2 INM1 D AVSS AVSS AVSS AVSS AVSS AVSS AVSS AVDD AVDD E CW_IP_AMPINP CW_IP_AMPINM AVSS AVSS AVSS AVSS AVSS AVDD AVDD F CW_IP_OUTM CW_IP_OUTP AVSS AVSS AVSS AVSS AVSS CLKP_16X CLKM_16X G AVSS AVSS AVSS AVSS AVSS AVSS AVSS CLKP_1X CLKM_1X H CW_QP_OUTM CW_QP_OUTP AVSS AVSS AVSS AVSS AVSS PDN_GLOBAL RESET J CW_QP_AMPINP CW_QP_AMPINM AVSS AVSS AVSS AVDD_ADC AVDD_ADC PDN_VCA SCLK K AVDD AVDD_5V VCNTLP VCNTLM VHIGH AVSS DNC AVDD_ADC SDATA L CLKP_ADC CLKM_ADC AVDD_ADC REFM DNC DNC DNC PDN_ADC SEN M AVDD_ADC AVDD_ADC VREF_IN REFP DNC DNC DNC DNC SDOUT N D8P D8M DVDD DNC DVSS DNC DVDD D1M D1P P D7M D6M D5M FCLKM DVSS DCLKM D4M D3M D2M R D7P D6P D5P FCLKP DVSS DCLKP D4P D3P D2P PIN FUNCTIONS PIN DESCRIPTION NO. NAME B9~ B2 ACT1...ACT8 Active termination input pins for CH1~8.