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0 hour readings or pre-life readings. TABLE 6. APPLICABLE SUBGROUPS CONFORMANCE GROUP METHOD GROUP A SUBGROUPS READ AND RECORD Initial Test (Preburn-In) 100%/5004 1, 7,

9 ICC, IOL/H Interim Test

1 (Postburn-In) 100%/5004 1, 7,

9 ICC, IOL/H Interim Test

2 (Postburn-In) 100%/5004 1, 7,

9 ICC, IOL/H PDA 100%/5004 1, 7, 9, Deltas Interim Test

3 (Postburn-In) 100%/5004 1, 7,

9 ICC, IOL/H PDA 100%/5004 1, 7, 9, Deltas Final Test 100%/5004 2, 3, 8A, 8B, 10,

11 Group A (Note 1) Sample/5005 1, 2, 3, 7, 8A, 8B, 9, 10,

11 Group B Subgroup B-5 Sample/5005 1, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas Subgroups 1, 2, 3, 9, 10,

11 Subgroup B-6 Sample/5005 1, 7,

9 Group D Sample/5005 1, 7,

9 NOTE: 1. Alternate Group A testing may be exercised in accordance with MIL-STD-883, Method 5005. TABLE 7. TOTAL DOSE IRRADIATION CONFORMANCE GROUP METHOD TEST READ AND RECORD PRE RAD POST RAD PRE RAD POST RAD Group E Subgroup

2 5005 1, 7,

9 Table

4 1,

9 Table

4 (Note 1) NOTE: 1. Except FN test which will be performed 100% Go/No-Go. TABLE 8. BURN-IN TEST CONNECTIONS (+125o C <

TA <

139o C) OPEN GROUND 1/2 VCC = 3V ?0.5V VCC = 6V ?0.5V OSCILLATOR 50kHz 25kHz STATIC BURN-IN I (Note 1) - 1, 2, 4, 5, 7, 9, 10, 12,

13 3, 6, 8,

11 14 - - STATIC BURN-IN II (Note 1) -

7 3, 6, 8,

11 1, 2, 4, 5, 9, 10, 12, 13,

14 - - DYNAMIC BURN-IN TEST CONNECTIONS (Note 1) -

7 3, 6, 8,

11 14 1, 2, 4, 5, 9, 10, 12,

13 - NOTE: 1. Each pin except VCC and GND will have a series resistor of 500? ?5%. TABLE 9. IRRADIATION TEST CONNECTIONS (TA = +25o C, ?5o C) FUNCTION OPEN GROUND VCC = 5V ?0.5V Irradiation Circuit (Note 1) 3, 6, 8,

11 7 1, 2, 4, 5, 9, 10, 11, 12, 13,

14 NOTE: 1. Each pin except VCC and GND will have a series resistor of 47k? ?5%. Group E, Subgroup 2, sample size is

4 dice/wafer,

0 failures. ACTS08MS FN3994 Rev 0.00 Page

5 of

8 April

1995 Propagation Delay Timing Diagram and Load Circuit Intersil - Space Products MS Screening Wafer Lot Acceptance (All Lots) Method

5007 (Includes SEM) Radiation Verification (Each Wafer) Method 1019,

4 Samples/Wafer,

0 Rejects 100% Nondestructive Bond Pull Method

2023 100% Internal Visual Inspection Method

2010 100% Temperature Cycling Method

1010 Condition C (-65o to +150o C) 100% Constant Acceleration 100% PIND Testing 100% External Visual Inspection 100% Serialization 100% Initial Electrical Test 100% Static Burn-In

1 Method 1015,

24 Hours at +125o C Min 100% Interim Electrical Test

1 (Note 1) 100% Static Burn-In

2 Method 1015,

24 Hours at +125o C Min 100% Interim Electrical Test

2 (Note 1) 100% Dynamic Burn-In Method 1015,

240 Hours at +125o C or

180 Hours at +135o C 100% Interim Electrical Test

3 (Note 1) 100% Final Electrical Test 100% Fine and Gross Seal Method

1014 100% Radiographics Method

2012 (2 Views) 100% External Visual Method

2009 Group A (All Tests) Method

5005 (Class S) Group B (Optional) Method

5005 (Class S) (Note 2) Group D (Optional) Method

5005 (Class S) (Note 2) CSI and/or GSI (Optional) (Note 2) Data Package Generation (Note 3) NOTES: 1. Failures from interim electrical tests

1 and

2 are combined for determining PDA (PDA = 5% for subgroups 1, 7,

9 and delta failures com- bined, PDA = 3% for subgroup

7 failures). Interim electrical tests

3 PDA (PDA = ........