PDF《Application Note》

1 cm (26 cm3 ) Dropped by 19% with a heatsink with a height of

2 cm (52 cm3 ) Adding a heatsink is considerably effective, compared to dissipating heat only from the PCB. Discrete Semiconductor DevicesHints and Tips for Thermal Design ? Part

2 Application Note 2018-07-26

4 ?

2018 Toshiba Electronic Devices &

Storage Corporation Connector 71.6 69.42 2.18 3.05% Ribbon 73.04 72.98 0.06 0.08% Wire 77.1 78.05 -0.95 -1.23% Connector 84.63 83.94 0.69 0.82% Ribbon 87.87 86.02 1.85 2.11% Wire 91.17 90.14 1.03 1.13% DSOP-Adv. Connector 79.86 79.04 0.82 1.03% PS-8 Wire 94.61 95.87 -1.26 -1.33% DPAK Wire 80.93 80.83 0.10 0.12% D2PAK Wire 74.35 75.37 -1.02 -1.37% SOP-Adv. TSON-Adv. Package Internal structure Measured temp. (℃) Sim temp. (℃) Temp. di?erence(℃) Accuracy Heatsink emissivity Dropped by 12% when the heatsink surface was treated with anodized aluminum (The emissivity increases from 0.04 to 0.8.) Consideration is required because anodization incurs extra cost. Thermal interference (Middle device when three devices were arranged in a row) Increased by 3% when the device spacing was

3 mm Did not increase when the device spacing was

12 mm In order to prevent thermal interference, it is important not to place heat-generating devices in close proximity. In addition, chip temperature may be reduced by isolating copper traces as appropriate and by adding vias between heat-generating devices to prevent heat dispersion. Thermal interface material (TIM) A thinner TIM provides better heat dissipation when the surface area is small. The TIM thickness should be carefully considered when a TIM is used for a small area. Note: Thermal interface material (TIM) is a thermally conductive material. 3. Simulation accuracy Before using simulation data, we compared measured and simulated chip temperatures. Table

1 shows the results. The simula........