PDF《TSSE3U45 - TSSE3U60》

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1 1.1 1.2 Pulse width TJ=25°C TJ=125°C UF1DLW FORWARD VOLTAGE (V) AVERAGE FORWARD CURRENT (A) LEAD TEMPERATURE (o C) Heat sink 5mm x 5mm Cu pad test board FORWARD VOLTAGE (V) TSSE3U45 TSSE3U45 - TSSE3U60 Taiwan Semiconductor

4 Version:G1707 CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.5 Typical Reverse Characteristics Fig.6 Typical Forward Characteristics 0.001 0.01 0.1

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1 1.2 TSSE3U60 TJ=125oC TJ=100oC TJ=25oC INSTANTANEOUS REVERSE CURRENT (mA) PERCENT OF RATED PEAK REVERSE VOLTAGE (%) FORWARD VOLTAGE (V) INSTANTANEOUS FORWARD CURRENT (A) 0.001 0.01 0.1

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1 1.1 1.2 Pulse width TJ=25°C TJ=125°C UF1DLW TSSE3U45 - TSSE3U60 Taiwan Semiconductor

5 Version:G1707 PACKAGE OUTLINE DIMENSIONS SOD-123HE SUGGESTED PAD LAYOUT MARKING DIAGRAM DIM. Unit (mm) Unit (inch) Min Max Min Max A 1.65 1.95 0.065 0.077 B 2.60 3.00 0.102 0.118 C 0.85 1.15 0.033 0.045 D 0.75 0.85 0.030 0.033 E 0.10 0.20 0.004 0.008 F 0.55 0.75 0.022 0.030 G 0.35 0.55 0.014 0.022 H 1.90 2.30 0.075 0.091 I 1.35 1.55 0.053 0.061 J 0.95 1.25 0.037 0.049 K 3.50 3.90 0.138 0.154 L 0.35 0.55 0.014 0.022 Symbol Unit (mm) Unit (inch) A 1.40 0.055 B 2.40 0.094 C 0.70 0.028 D 0.90 0.035 E 1.40 0.055 P/N = Marking Code YW = Date Code F = Factory Code TSSE3U45 - TSSE3U60 Taiwan Semiconductor

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