PDF《APPLICATION NOTE》

2 package, almost all the heat from the die is conducted through the Cu slug and very little through the leads. Figure

4 shows the relationship between ?JC and die size for a given package and die attach material. ?CH―Thermal resistance from case to heatsink is dependent upon the thermal properties of the interface used to attach the heatsink to the copper slug of the package. Various types of heat conducting pads, thermal greases and thermal epoxy bonding materials are available from several manufacturers. Table

2 shows estimated values of ?CH for several types of epoxy bonding materials. ?HA―Thermal resistance from heatsink to ambient is a function of the conduction through heatsink material to the dissipating surface area;

convection (natural or forced);

and radiation from the heatsink surface area. Different designs of PSOP 2―EXPOSED SLUG WITH COUPLED LEADS FIGURE 1.

28 PSOP

2 STRUCTURE FIGURE 2.

28 PSOP

2 BOARD MOUNTING OPTIONS ? PowerSOP2: ―Di........