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2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017, p1-4, 2017. (EI, DOI: 10.1109/EPTC.2017.8277431) 2019/1/10 朱福龙-华中科技大学机械科学与工程学院 http://mse.hust.edu.cn/info/1011/1043.htm 4/15 [9] Xinxin Lin, Fulong Zhu*, Liping He, Yongjun Pan, Jiaquan Tao, Ke Duan, Subsurface damage mechanism of wafer thinning process revealed by molecular dynamics simulation , in

2016 17th International Conference on Electronic Packaging Technology, ICEPT2016, p417-420,

2016 (EI, DOI:10.1109/ICEPT. 2016.7583166). [10] Zhu Fulong*, Kan Yan, Kan Tang, Sheng Liu, Investigation of Thermal Properties of Ni-Coated Graphene Nanoribbons Based on Molecular Dynamics Methods , Journal of Electronic Materials, v46, n8, p.4733-4739, 2017. (SCI,EI, DOI: 10.1007/s11664-017-5542-5) [11] Liping He, Fulong Zhu*, Yanming Chen, Ke Duan, Xinxin Lin, Yongjun Pan, Jianquan Tao, Ultrasonic power measurement system based on acousto-optic interaction , Review of Scientific Instruments, v87, n5, p1-8, 2016.(SCI,EI, DOI: 10.1063/1.4948731) [12] Liping He, Fulong Zhu*, Yuhong Liu, Sheng Liu, Investigaton of machining mechanism of monocrystalline silicon in nanometric grinding , AIP Advances, Vol.7, Issue 5, 2017. (SCI, EI, DOI: 10.1063/1.4983216) [13] Liping He, Fulong Zhu*,Ke Duan,Kai Tang, Sheng Liu, Mechanical response of copper nanowires under torsion , in

2015 16th International Conference on Electronic Packaging Technology, ICEPT2015, p318-322, 2015. (EI, DOI: 10.1109/ICEPT. 2015. 7236600) [14] Fulong Zhu*, Hengyou Liao, Kai Tang, Youkai Chen, Sheng Liu, Molecular dynamics study on the effect of temperature on the tensile properties of single-walled carbon nanotubes with a Ni-coating , Journal of Nanomaterials, v 2015, 2015(SCI, EI, DOI: 10.1155/2015/767182) [15] Wei Zhang, Fulong Zhu*, Honghai Zhang, Sheng Liu, An Adjustable Sensitivity Shadow Moiré Technique for Surface Morphology Measurement , Journal of Modern Optics, v61, n8, p641-649, 2014. (SCI, EI, DOI: 10.1080/09500340. 2014. 904941) [16] Wei Zhang, Fulong Zhu*, Yiquan Dai, Hengyou Liao, Shao Song, Honghai Zhang, Sheng Liu, Warpage measurement of silicon wafers of various bonding areas , in

2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP2012, p1164-1167, 2012. ( EI, DOI: 10.1109/ICEPT- HDP.2012.6474814) 2019/1/10 朱福龙-华中科技大学机械科学与工程学院 http://mse.hust.edu.cn/info/1011/1043.htm 5/15 [17] Wei Zhang, Fulong Zhu, Shao Song, Honghai Zhang, Sheng Liu, 3-D warpage measurement of silicon wafer , in

2011 2nd International Conference on Artificial Intelligence, Management Science and Electronic Commerce, AIMSEC 2011, p3603-3605,2011. (EI, DOI: 10.1109/AIMSEC.2011.6010064) [18] Ying Li, Fulong Zhu*, Yanming Chen, Ke Duan, Kai Tang, Sheng Liu, Analysis of insertion force of electric connector based on FEM ,

2014 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA2014,p195-198, 2014. (EI, DOI: 10.1109/IPFA.2014.6898160) [19] Ke Duan, Fulong Zhu*, Kai Tang, Liping He, Yanming Chen, Sheng Liu, Effect of Chirality and Number of Graphene Layers on the Mechanical Properties of Graphene-Embedded Copper Nanocomposites , Computational Materials Science, v117, p294-299, 2016.(SCI, EI, DOI: 10.1016/j.commatsci.2016.02.007) [20] Fulong Zhu*, Ke Duan, Liping He, Kai Tang, Ying Li, Sheng Liu, Effects of Chirality and Position of Graphene on the Bending Properties of Graphene-Embedded Copper Nanocomposites , Journal of Nanoscience and Nanotechnology, Vol.17. Issue 5, p3105-3110,