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2017 (SCI,EI, DOI: 10.1166/jnn. 2017. 13040) [21] Ke Duan, Fulong Zhu*, Ying Li, Kai Tang, Sheng Liu, Yanming Chen, Contact Resistance Investigation of Electrical Connector with Different Shrink Range , in

2014 15th International Conference on Electronic Packaging Technology, ICEPT2014, p1146-1149, 2014. (EI, DOI:10.1109/ICEPT.2014. 6922846) [22] Ke Duan, Fulong Zhu*, Mingxiang Chen, Ying Li, Yanming Chen, Warpage Analysis of DBC Substrate based on Non-contact Shadow Moiré Technology ,

2014 The 15th International Conference on Electronic Packaging Technology, ICEPT2014, p1427-1430,2014.( EI, DOI: 10.1109/ICEPT.2014.6922923) [23] Kai Tang, Fulong Zhu*, Ying Li, Ke Duan, Sheng Liu, Yanming Chen, Effect of Defects on Thermal Conductivity of Graphene ,

2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014, p592-595, 2014. ( EI, DOI: 10.1109/ICEPT.2014.6922725) [24] Kai Tang, Fulong Zhu*, Youkai Chen, Ying Li, Hengyou Liao, Sheng Liu, Molecular Dynamics Simulation on Thermal Conductivity of Single-Walled Carbon Nanotubes ,

2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, p583-586, 2013.( EI, DOI: 10.1109/ICEPT.2013.6756538) 2019/1/10 朱福龙-华中科技大学机械科学与工程学院 http://mse.hust.edu.cn/info/1011/1043.htm 6/15 [25] Kai Tang, Fulong Zhu*, Youkai Chen, Ying Li, Hengyou Liao , Xiahui Chen, Sheng Liu, Effect of Vacancy Defects on Thermal Conductivity of Single-walled Carbon Nanotube ,

2013 IEEE 15th Electronics Packaging Technology Conference, EPTC2013, p817-820, p2013. ( EI, DOI: 10.1109/EPTC. 2013.6745835) [26] Fulong Zhu*, Kai Tang, Ying Li, Ke Duan, Sheng Liu, Yanming Chen, Heat conduction study across metal/graphene interface by molecular dynamics ,

2014 16th IEEE Electronics Packaging Technology Conference, EPTC2014, p833-836, 2014. ( EI, DOI: 10.1109/EPTC.2014.7028411) [27] Simin Wang, Xing Chen, Sheng Liu, Fulong Zhu, Xiaogang Liu, Estimation of homogenized Young'

s modulus of silicone/phosphor composite considering random dispersion and size variation of phosphor particles , Journal of Composite Materials, v50, n14, p1981-1988, 2015. (SCI,EI, DOI:10. 1177/0021998315597992) [28] Youkai Chen, Fulong Zhu*, Hengyou Liao, Shao Song, Sheng Liu, The effect of temperature on compressive mechanical behavior of SWCNT-Ni ,

2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012, p633-636, 2012. (EI, DOI:10.1109/ICEPT-HDP. 2012. 6474697) [29] Youkai Chen, Fulong Zhu*, Hengyou Liao, Shao Song, Sheng Liu, Compressing Deformation Investigation of Single-Walled Carbon Nanotube Coated with Ni ,the

2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012, p728-731, 2012. ( EI, DOI:10.1109/EPTC. 2012.6507178) [30] Youkai Chen, Fulong Zhu, Kai Tang, Ying Li, Hengyou Liao, Sheng Liu, Mechanical behavior investigation of single-walled carbon nanotubes with one vacancy ,

2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, p579-582, 2013. (EI, DOI: 10.1109/ICEPT. 2013.6756537) [31] Youkai Chen, Fulong Zhu*, Kai Tang, Ying Li, Hengyou Liao, Xiahui Chen, Sheng Liu, Mechanical Properties Investigation of Graphene Coated with Ni , the

2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013, p756-759,2013.( EI, DOI: 10.1109/EPTC.2013.6745822) [32] Hengyou Liao, Fulong Zhu*, Sheng Liu, Mechanical stretching behavior simulation of SWCNT and SWCNT-Ni ,

2011 International Symposium on ........