PDF《DATASHEET》

18 Digital-DC Bus

19 Phase Spreading

19 Output Sequencing

19 Fault Spreading

19 Temperature Monitoring Using XTEMP Pin.19 Monitoring Using SMBus.19 Snapshot Parameter Capture

20 Nonvolatile Memory

20 PCB Layout Guidelines

20 Thermal Considerations

21 Package Description

21 PCB Layout Pattern Design

21 Thermal Vias.21 Stencil Pattern Design

21 Reflow Parameters

21 PMBus Command Summary

22 PMBus Data Formats.25 PMBus Use Guidelines

26 Summary

26 PMBus Commands Description

26 Revision History.49 About Intersil

49 Package Outline Drawing

50 ISL8270M FN8635 Rev.4.00 Page

3 of

56 Aug 17,

2017 Firmware Revision History Ordering Information PART NUMBER (Notes 2, 3, 4) PART MARKING FIRMWARE REVISION (Note 5) TEMP RANGE (°C) PACKAGE (RoHS Compliant) PKG. DWG. # ISL8270MAIRZ ISL8270M FC01 -40 to +85

40 Ld 17x19 HDA Y40.17x19 ISL8270MBIRZ ISL8270MB FC02 -40 to +85

40 Ld 17x19 HDA Y40.17x19 ISL8270MEVAL1Z Evaluation Board NOTES: 2. Add -T suffix for a

500 unit Tape and Reel option. Refer to TB347 for details on reel specifications. 3. These Intersil Pb-free plastic packaged products are RoHS compliant by EU exemption 7C-I and 7A. They employ special Pb-free material sets;

molding compounds/die attach materials and NiPdAu plate - e4 termination finish, which is compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 4. For Moisture Sensitivity Level (MSL), please see the product information page for ISL8270M. For more information on MSL, see TB363 5. See Firmware Revision History ;

only the latest firmware revision is recommended for new designs. ISL xxxxM F T R Z S INTERSIL DEVICE DESIGNATOR BASE PART NUMBER FIRMWARE REVISION A: FC01 B: FC02 OPERATING TEMPERATURE I: INDUSTRIAL (- 40°C TO +85°C) SHIPPING OPTION BLANK: BULK T: TAPE AND REEL ROHS Z: ROHS COMPLIANT PACKAGE DESIGNATOR R: HIGH DENSITY ARRAY (HDA) TABLE 1. ISL8270M NOMENCLATURE GUIDE FIRMWARE REVISION CODE CHANGE DESCRIPTION NOTE ISL8270-000-FC01 Initial Release Not recommended for new designs ISL8270-000-FC02 1. Fixed bug: PMBus address read issue at low temperature 2. Fixed bug: PMBus locks up when noise is present 3. Corrected snapshot functionality behavior 4. Changed VIN_OV_WARN_LIMIT to 13.2V 5. Changed VIN_OV_FAULT_LIMIT to 14.5V Recommended for new designs ISL8270M FN8635 Rev.4.00 Page

4 of

56 Aug 17,

2017 Pin Configuration ISL8270M (40 LD HDA) TOP VIEW SALRT NC NC EN SCL SDA SA MGN VSET SGND PGND VDD VDRVOUT VIN SYNC DDC XTEMP+ VSEN - XTEMP - NC VSEN+ NC SGND VOUT SGND VSWH PGND PGND PG UVLO PGND PHASE PGND NC NC VDDC V25 VR5 VR6 VDRVIN

1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

17 26

27 28

29 30

31 32

33 34

35 36

37 38

39 40

18 19

20 21

22 23

24 25 Pin Descriptions PIN LABEL TYPE DESCRIPTION

1 DDC I/O Digital-DC? bus. This dedicated bus provides the communication channel between devices for features such as sequencing and fault spreading. The DDC pin on all Digital-DC devices should be connected together. A pull-up resistor is required for this application.

2 XTEMP+ I Differential external temperature sensor positive input pin.

3 XTEMP- I Differential external temperature sensor negative input pin.

6 VSEN+ I Differential Output voltage sense feedback. Connect to the positive output regulation point.

7 VSEN- I Differential Output voltage sense feedback. Connect to the negative output regulation point.